C8051F702-GQ Silicon Laboratories Inc, C8051F702-GQ Datasheet - Page 44

• Manufacturer Part Number: C8051F702-GQ
• Description: IC 8051 MCU 16K FLASH 64-TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F70xr

Specifications of C8051F702-GQ

• Program Memory Type: FLASH
• Program Memory Size: 16KB (16K x 8)
• Package / Case: 64-TQFP, 64-VQFP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Cap Sense, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 54
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F7x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 4 x 16 bit
• Operating Supply Voltage: 1.8 V to 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F700DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1635 - DEV KIT FOR C8051F700
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1608

C8051F70x/71x
44
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 3x3 array of 1.0 mm openings on a 1.25 mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
C2
X1
E
mask and the metal pad is to be 60 µm minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume.
Body Components.
Figure 7.2. QFN-32 Recommended PCB Land Pattern
Table 7.2. QFN-32 PCB Land Pattern Dimensions
0.20
Min
4.60
4.60
0.50
0.30
Max
Rev. 1.0
Dimension
X2
Y1
Y2
3.60
0.45
3.60
Min
Max
3.70
0.55
3.70