MC9S12E64CFUE Freescale Semiconductor, MC9S12E64CFUE Datasheet - Page 473

IC MCU 64K FLASH 25MHZ 80-QFP

MC9S12E64CFUE

Manufacturer Part Number
MC9S12E64CFUE
Description
IC MCU 64K FLASH 25MHZ 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12E64CFUE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
60
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.75 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Package
80PQFP
Family Name
HCS12
Maximum Speed
25 MHz
Operating Supply Voltage
2.5|3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
60
Interface Type
SCI/SPI
On-chip Adc
16-chx10-bit
On-chip Dac
2-chx8-bit
Number Of Timers
12
Processor Series
S12E
Core
HCS12
Data Ram Size
4 KB
Maximum Clock Frequency
25 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Minimum Operating Temperature
- 40 C
Controller Family/series
HCS12/S12X
No. Of I/o's
58
Ram Memory Size
4KB
Cpu Speed
25MHz
No. Of Timers
4
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
For Use With
M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12E64CFUE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12E64CFUE
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MC9S12E64CFUER
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Chapter 16
Debug Module (DBGV1)
16.1
This section describes the functionality of the debug (DBG) sub-block of the HCS12 core platform.
The DBG module is designed to be fully compatible with the existing BKP_HCS12_A module (BKP
mode) and furthermore provides an on-chip trace buffer with flexible triggering capability (DBG mode).
The DBG module provides for non-intrusive debug of application software. The DBG module is optimized
for the HCS12 16-bit architecture.
16.1.1
The DBG module in BKP mode includes these distinctive features:
Freescale Semiconductor
Full or dual breakpoint mode
— Compare on address and data (full)
— Compare on either of two addresses (dual)
BDM or SWI breakpoint
— Enter BDM on breakpoint (BDM)
— Execute SWI on breakpoint (SWI)
Tagged or forced breakpoint
— Break just before a specific instruction will begin execution (TAG)
— Break on the first instruction boundary after a match occurs (Force)
Single, range, or page address compares
— Compare on address (single)
— Compare on address 256 byte (range)
— Compare on any 16K page (page)
At forced breakpoints compare address on read or write
High and/or low byte data compares
Comparator C can provide an additional tag or force breakpoint (enhancement for BKP mode)
Introduction
Features
MC9S12E128 Data Sheet, Rev. 1.07
473

Related parts for MC9S12E64CFUE