MC9S12E256MFUE Freescale Semiconductor, MC9S12E256MFUE Datasheet - Page 469

• Manufacturer Part Number: MC9S12E256MFUE
• Description: IC MCU 256K FLASH 25MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E256MFUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 60
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 60
• Ram Memory Size: 16KB
• Cpu Speed: 25MHz
• No. Of Timers: 3
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 16
Debug Module (DBGV1)
16.1
This section describes the functionality of the debug (DBG) sub-block of the HCS12 core platform.
The DBG module is designed to be fully compatible with the existing BKP_HCS12_A module (BKP
mode) and furthermore provides an on-chip trace buffer with flexible triggering capability (DBG mode).
The DBG module provides for non-intrusive debug of application software. The DBG module is optimized
for the HCS12 16-bit architecture.
16.1.1
The DBG module in BKP mode includes these distinctive features:
Freescale Semiconductor
•
•
•
•
•
•
•
Full or dual breakpoint mode
— Compare on address and data (full)
— Compare on either of two addresses (dual)
BDM or SWI breakpoint
— Enter BDM on breakpoint (BDM)
— Execute SWI on breakpoint (SWI)
Tagged or forced breakpoint
— Break just before a specific instruction will begin execution (TAG)
— Break on the first instruction boundary after a match occurs (Force)
Single, range, or page address compares
— Compare on address (single)
— Compare on address 256 byte (range)
— Compare on any 16K page (page)
At forced breakpoints compare address on read or write
High and/or low byte data compares
Comparator C can provide an additional tag or force breakpoint (enhancement for BKP mode)
Introduction
Features
MC9S12E256 Data Sheet, Rev. 1.08
469