C8051F34A-GM Silicon Laboratories Inc, C8051F34A-GM Datasheet - Page 273

IC 8051 MCU 64K FLASH MEM 32-QFN

C8051F34A-GM

Manufacturer Part Number
C8051F34A-GM
Description
IC 8051 MCU 64K FLASH MEM 32-QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F34xr
Datasheet

Specifications of C8051F34A-GM

Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
32-QFN
Core Processor
8051
Core Size
8-Bit
Speed
48MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
25
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 17x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4352 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Operating Supply Voltage
2.7 V to 5.25 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-F34X, KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F340DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Package
32QFN EP
Device Core
8051
Family Name
C8051F34x
Maximum Speed
48 MHz
Cpu Family
C8051F34x
Device Core Size
8b
Frequency (max)
48MHz
Total Internal Ram Size
4.25KB
# I/os (max)
25
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
2.7V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
32
Package Type
QFN EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1748 - ADAPTER TOOLSTICK FOR C8051F34X
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1350-5
23.2. C2 Pin Sharing
The C2 protocol allows the C2 pins to be shared with user functions so that in-system debugging and
Flash programming functions may be performed. This is possible because C2 communication is typically
performed when the device is in the halt state, where all on-chip peripherals and user software are stalled.
In this halted state, the C2 interface can safely ‘borrow’ the C2CK (RST) and C2D (P3.0) pins. Note that
the C2D pin is shared on the 32-pin packages only (C8051F342/3/6/7/9/A/B). In most applications, exter-
nal resistors are required to isolate C2 interface traffic from the user application. A typical isolation configu-
ration is shown in Figure 23.1.
The configuration in Figure 23.1 assumes the following:
Additional resistors may be necessary depending on the specific application.
1. The user input (b) cannot change state while the target device is halted.
2. The RST pin on the target device is used as an input only.
Output (c)
RST (a)
Input (b)
C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
Figure 23.1. Typical C2 Pin Sharing
C2 Interface Master
Rev. 1.3
C2CK
C2D
C8051Fxxx
273

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