C8051F34A-GM Silicon Laboratories Inc, C8051F34A-GM Datasheet - Page 4

• Manufacturer Part Number: C8051F34A-GM
• Description: IC 8051 MCU 64K FLASH MEM 32-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F34xr

Specifications of C8051F34A-GM

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 32-QFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 25
• Ram Size: 4.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 17x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 4352 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: KSK-SL-F34X, KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F340DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Package: 32QFN EP
• Device Core: 8051
• Family Name: C8051F34x
• Maximum Speed: 48 MHz
• Cpu Family: C8051F34x
• Device Core Size: 8b
• Frequency (max): 48MHz
• Total Internal Ram Size: 4.25KB
• # I/os (max): 25
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.25V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Package Type: QFN EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1748 - ADAPTER TOOLSTICK FOR C8051F34X
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1350-5

C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
12. Flash Memory ....................................................................................................... 107
13. External Data Memory Interface and On-Chip XRAM........................................ 114
14. Oscillators ............................................................................................................. 131
4
11.2.Power-Fail Reset / VDD Monitor .................................................................... 102
11.3.External Reset ................................................................................................ 103
11.4.Missing Clock Detector Reset ........................................................................ 103
11.5.Comparator0 Reset ........................................................................................ 103
11.6.PCA Watchdog Timer Reset .......................................................................... 103
11.7.Flash Error Reset ........................................................................................... 103
11.8.Software Reset ............................................................................................... 104
11.9.USB Reset...................................................................................................... 104
12.1.Programming The Flash Memory ................................................................... 107
12.2.Non-Volatile Data Storage.............................................................................. 109
12.3.Security Options ............................................................................................. 109
13.1.Accessing XRAM............................................................................................ 114
13.2.Accessing USB FIFO Space .......................................................................... 115
13.3.Configuring the External Memory Interface .................................................... 116
13.4.Port Configuration........................................................................................... 116
13.5.Multiplexed and Non-multiplexed Selection.................................................... 119
13.6.Memory Mode Selection................................................................................. 120
13.7.Timing .......................................................................................................... 122
14.1.Programmable Internal High-Frequency (H-F) Oscillator ............................... 132
14.2.Programmable Internal Low-Frequency (L-F) Oscillator ................................ 133
14.3.External Oscillator Drive Circuit...................................................................... 135
14.4.4x Clock Multiplier .......................................................................................... 138
14.5.System and USB Clock Selection .................................................................. 139
12.1.1.Flash Lock and Key Functions ............................................................... 107
12.1.2.Flash Erase Procedure .......................................................................... 107
12.1.3.Flash Write Procedure ........................................................................... 108
13.1.1.16-Bit MOVX Example ........................................................................... 114
13.1.2.8-Bit MOVX Example ............................................................................. 114
13.5.1.Multiplexed Configuration....................................................................... 119
13.5.2.Non-multiplexed Configuration............................................................... 120
13.6.1.Internal XRAM Only ............................................................................... 121
13.6.2.Split Mode without Bank Select.............................................................. 121
13.6.3.Split Mode with Bank Select................................................................... 122
13.6.4.External Only.......................................................................................... 122
13.7.1.Non-multiplexed Mode ........................................................................... 124
13.7.2.Multiplexed Mode ................................................................................... 127
14.1.1.Internal H-F Oscillator Suspend Mode ................................................... 132
14.2.1.Calibrating the Internal L-F Oscillator..................................................... 133
14.3.1.Clocking Timers Directly Through the External Oscillator...................... 135
14.3.2.External Crystal Example....................................................................... 135
14.3.3.External RC Example............................................................................. 136
14.3.4.External Capacitor Example................................................................... 136
Rev. 1.3