PIC16C770-I/P Microchip Technology, PIC16C770-I/P Datasheet - Page 5

• Manufacturer Part Number: PIC16C770-I/P
• Description: IC MCU CMOS A/D 2K 20MHZ 20-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C770-I/P

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 15
• Program Memory Type: OTP
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 6x12b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16C
• No. Of I/o's: 16
• Ram Memory Size: 256Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• No. Of: RoHS Compliant
• Core: PIC
• Processor Series: PIC16C
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 20 MHz
• Data Ram Size: 256 B
• Data Rom Size: 256 B
• On-chip Adc: 6 bit
• Number Of Programmable I/os: 16
• Number Of Timers: 3 bit
• Operating Supply Voltage: 2.5 V to 5.5 V
• Mounting Style: Through Hole
• Height: 3.3 mm
• Interface Type: I2C, SPI, SSP
• Length: 26.16 mm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA16XP200 - ADAPTER ICE 20DIP/SOIC/SSOPAC164028 - MODULE SKT PROMATEII 20SOIC/DIP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: PIC16C770I/P

Table of Contents
1.0 Device Overview ...................................................................................................................................................... 5
2.0 Memory Organization............................................................................................................................................... 9
3.0 I/O Ports ................................................................................................................................................................. 25
4.0 Program Memory Read (PMR) .............................................................................................................................. 41
5.0 Timer0 Module ....................................................................................................................................................... 45
6.0 Timer1 Module ....................................................................................................................................................... 47
7.0 Timer2 Module ....................................................................................................................................................... 51
8.0 Enhanced Capture/Compare/PWM (ECCP) Modules............................................................................................ 53
9.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................. 65
10.0 Voltage Reference Module and Low-voltage Detect.......................................................................................... 101
11.0 Analog-to-Digital Converter (A/D) Module.......................................................................................................... 105
12.0 Special Features of the CPU ............................................................................................................................. 117
13.0 Instruction Set Summary.................................................................................................................................... 133
14.0 Development Support ........................................................................................................................................ 141
15.0 Electrical Characteristics.................................................................................................................................... 147
16.0 DC and AC Characteristics Graphs and Tables................................................................................................. 179
17.0 Packaging Information ....................................................................................................................................... 197
APPENDIX A: Revision History ............................................................................................................................... 207
APPENDIX B: Device Differences ............................................................................................................................ 208
Index .......................................................................................................................................................................... 209
On-Line Support.......................................................................................................................................................... 215
Reader Response ....................................................................................................................................................... 216
PIC16C717/770/771 Product Identification System .................................................................................................... 217
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PIC16C717/770/771
DS41120B-page 3