PIC16F870T-I/SS Microchip Technology, PIC16F870T-I/SS Datasheet - Page 155

IC MCU FLASH 2KX14 EE 28SSOP

PIC16F870T-I/SS

Manufacturer Part Number
PIC16F870T-I/SS
Description
IC MCU FLASH 2KX14 EE 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F870T-I/SS

Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SSOP
For Use With
I3-DB16F871 - BOARD DAUGHTER ICEPIC3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
 2003 Microchip Technology Inc.
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
B
c
p
n
Dimension Limits
E1
E
Units
A2
A1
E1
A
E
D
B
n
p
L
c
2
1
MIN
L
.068
.064
.002
.299
.396
.022
.004
.010
.201
D
0
0
0
INCHES
A1
NOM
.026
.073
.068
.006
.309
.207
.402
.030
.007
.013
A
28
4
5
5
MAX
.078
.072
.010
.319
.212
.407
.037
.010
.015
10
10
8
MIN
PIC16F870/871
10.06
1.73
1.63
0.05
7.59
0.56
0.10
0.00
0.25
5.11
0
0
MILLIMETERS*
NOM
101.60
10.20
0.65
1.85
1.73
0.15
7.85
5.25
0.75
0.18
0.32
28
5
5
MAX
DS30569B-page 153
203.20
10.34
A2
1.98
1.83
0.25
8.10
5.38
0.94
0.25
0.38
10
10

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