PIC18F4431-E/P Microchip Technology, PIC18F4431-E/P Datasheet - Page 8

IC MCU FLASH 8KX16 40DIP

PIC18F4431-E/P

Manufacturer Part Number
PIC18F4431-E/P
Description
IC MCU FLASH 8KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4431-E/P

Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Power Control PWM, QEI, POR, PWM, WDT
Number Of I /o
36
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC18
No. Of I/o's
36
Eeprom Memory Size
256Byte
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
EUSART, I2C, SPI, SSP
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
1 x 8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
9 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LDACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
 Details

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PIC18F2331/2431/4331/4431
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Interrupts .................................................................................................................................................................................... 97
11.0 I/O Ports ................................................................................................................................................................................... 113
12.0 Timer0 Module ......................................................................................................................................................................... 127
13.0 Timer1 Module ......................................................................................................................................................................... 131
14.0 Timer2 Module ......................................................................................................................................................................... 136
15.0 Timer5 Module ......................................................................................................................................................................... 139
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 145
17.0 Motion Feedback Module ......................................................................................................................................................... 151
18.0 Power Control PWM Module .................................................................................................................................................... 173
19.0 Synchronous Serial Port (SSP) Module ................................................................................................................................... 205
20.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 217
21.0 10-Bit High-Speed Analog-to-Digital Converter (A/D) Module ................................................................................................. 239
22.0 Low-Voltage Detect (LVD)........................................................................................................................................................ 257
23.0 Special Features of the CPU .................................................................................................................................................... 263
24.0 Instruction Set Summary .......................................................................................................................................................... 283
25.0 Development Support............................................................................................................................................................... 325
26.0 Electrical Characteristics .......................................................................................................................................................... 329
27.0 Packaging Information.............................................................................................................................................................. 363
Appendix A: Revision History............................................................................................................................................................. 375
Appendix B: Device Differences......................................................................................................................................................... 375
Appendix C: Conversion Considerations ........................................................................................................................................... 376
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 376
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 377
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 377
INDEX ................................................................................................................................................................................................ 379
The Microchip Web Site ..................................................................................................................................................................... 389
Customer Change Notification Service .............................................................................................................................................. 389
Customer Support .............................................................................................................................................................................. 389
Reader Response .............................................................................................................................................................................. 390
Product Identification System............................................................................................................................................................. 391
DS39616D-page 8
Device Overview ........................................................................................................................................................................ 11
Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 25
Oscillator Configurations ............................................................................................................................................................ 29
Power-Managed Modes ............................................................................................................................................................. 39
Reset .......................................................................................................................................................................................... 47
Memory Organization ................................................................................................................................................................. 61
Data EEPROM Memory ............................................................................................................................................................. 79
Flash Program Memory .............................................................................................................................................................. 85
8 x 8 Hardware Multiplier............................................................................................................................................................ 95
 2010 Microchip Technology Inc.

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