LPC3180FEL320,551 NXP Semiconductors, LPC3180FEL320,551 Datasheet - Page 30

• Manufacturer Part Number: LPC3180FEL320,551
• Description: IC ARM9 MCU 208MHZ 320-LFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC3000r

Specifications of LPC3180FEL320,551

• Program Memory Type: ROMless
• Package / Case: 320-LFBGA
• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 208MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, UART/USART, USB OTG
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 55
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.3 V
• Data Converters: A/D 3x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC31
• Core: ARM926EJ-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: I2C/SPI/UART/USB
• Maximum Clock Frequency: 208 MHz
• Number Of Programmable I/os: 55
• Number Of Timers: 2
• Operating Supply Voltage: 3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, LPC3180-DEV-KIT
• Development Tools By Supplier: OM10096
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 3-ch x 10-bit
• Package: 320LFBGA
• Device Core: ARM926EJ-S
• Family Name: LPC3100
• Maximum Speed: 208 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1018 - EVAL KIT FOR LP3180568-4063 - KIT DEV LPC3180568-4062 - DEBUGGER J-LINK JTAG568-4061 - DEBUGGER U-LINK2 JTAG FOR NXP
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 935281874551; LPC3180FEL320-S; LPC3180FEL320-S

NXP Semiconductors
Table 5.
T
LPC3180_01_1
Preliminary data sheet
amb
Symbol
I
I
I
C
V
V
V
I
I
I
I
I
Z
I
V
V
V
I
I
I
C
latch
pu
pd
OH
OL
OZ
OHS
OLS
2
IL
IH
latch
o
O
OH
OL
I
IH
IL
i
C-bus pins
i
=
−
40
°
Static characteristics for the LPC3180/01
C to +85
Parameter
I/O latch-up
current
pull-up current
pull-down
current
input
capacitance
output voltage
HIGH-level
output voltage
LOW-level
output voltage
HIGH-level
output current
LOW-level
output current
OFF-state
output current
HIGH-level
short-circuit
output current
LOW-level
short-circuit
output current
output
impedance
input voltage
HIGH-level
input voltage
LOW-level
input voltage
LOW-level
input current
HIGH-level
input current
I/O latch-up
current
input
capacitance
°
C, unless otherwise specified.
Conditions
−(1.5V
1.8 V inputs with pull-up; V
3.3 V inputs with pull-up; V
1.8 V inputs with pull-down;
V
3.3 V inputs with pull-down;
V
excluding bonding
pad capacitance
1.8 V outputs; I
3.3 V outputs; I
1.8 V outputs; I
3.3 V outputs; I
V
V
V
V
V
no pull-up/down
V
V
V
V
V
V
1.8 V inputs
3.3 V inputs
1.8 V inputs
3.3 V inputs
V
V
−(1.5V
Excluding bonding pad
capacitance
I
I
DD
DD
DD
DD
O
DD
DD
DD
DD
DD
DD
I
I
= V
= V
= 0 V; no pull-up
= V
= 0 V; V
= 1.8 V; V
= 3.3 V; V
= 1.8 V; V
= 3.3 V; V
= 1.8 V; V
= 3.3 V; V
= 1.8 V; V
= 3.3 V; V
= 1.8 V
= 3.3 V
DD(SDRAM)
DD(SDRAM)
DD(IO)
DD
DD
) < V
) < V
O
; no pull-down
= V
I
I
OH
OH
OL
OL
OH
OH
OL
OL
< (1.5V
< (1.5V
OH
OH
OL
OL
Rev. 00.08 — 20 November 2008
DD
= 0.4 V
= 0.4 V
= V
= V
= V
= V
= 0 V
=0 V
= 4 mA
= 4 mA
= −1 mA
= −4 mA
16/32-bit ARM microcontroller with external memory interface
;
DD
DD
DD
DD
DD
DD
− 0.4 V
…continued
− 0.4 V
)
)
I
I
= 0
= 0
[9][10]
[7][11]
[7][11]
[7][11]
[7][8]
[7][9]
[12]
[11]
[11]
[11]
[11]
[7]
[7]
[7]
[7]
Min
-
34
97
23
73
-
0
V
V
-
-
−6
−6
6
6
-
-
-
-
-
35
32
0
0.7 × V
0.7 × V
-
-
-
-
-
-
DD(SDRAM)
DD(SDRAM)
DD(IO)
DD(IO)
− 0.3 -
− 0.3 -
Typ
-
62
169
51
155
-
-
-
-
-
-
-
-
-
-
-
-
-
40
35
-
-
-
-
-
-
-
-
-
[1]
LPC3180/01
58
45
Max
100
107
271
93
266
2.1
V
-
-
0.3
0.3
-
-
-
-
0.3
−49
−81
49
86
5.5
-
-
0.3 × V
0.3 × V
10
10
100
1.6
DD(SDRAM)
© NXP B.V. 2008. All rights reserved.
DD(IO)
DD(IO)
30 of 56
Unit
mA
μA
μA
μA
μA
pF
V
V
V
V
V
mA
mA
mA
mA
μA
mA
mA
mA
mA
ohm
ohm
V
V
V
V
V
μA
μA
mA
pF