C8051F343-GQ Silicon Laboratories Inc, C8051F343-GQ Datasheet - Page 121
![IC 8051 MCU FLASH 32K 32LQFP](/photos/12/37/123738/c8051f343-gq_sml.jpg)
C8051F343-GQ
Manufacturer Part Number
C8051F343-GQ
Description
IC 8051 MCU FLASH 32K 32LQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F34xr
Specifications of C8051F343-GQ
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
32-LQFP
Core Processor
8051
Core Size
8-Bit
Speed
48MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
25
Ram Size
2.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 21x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
2304 B
Interface Type
I2C, SMBus, SPI, UART, USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Operating Supply Voltage
2.7 V to 5.25 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-F34X, KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F340DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 17 Channel
Package
32LQFP
Device Core
8051
Family Name
C8051F34x
Maximum Speed
48 MHz
Data Rom Size
128 B
A/d Bit Size
10 bit
A/d Channels Available
17
Height
1.4 mm
Length
7 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Width
7 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1748 - ADAPTER TOOLSTICK FOR C8051F34X770-1006 - ISP 4PORT FOR SILABS C8051F MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1301
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F343-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Company:
Part Number:
C8051F343-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
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13.6.1. Internal XRAM Only
When EMI0CF.[3:2] are set to ‘00’, all MOVX instructions will target the internal XRAM space on the
device. Memory accesses to addresses beyond the populated space will wrap on 2k or 4k boundaries
(depending on the RAM available on the device). As an example, the addresses 0x1000 and 0x2000 both
evaluate to address 0x0000 in on-chip XRAM space.
•
•
13.6.2. Split Mode without Bank Select
When EMI0CF.[3:2] are set to ‘01’, the XRAM memory map is split into two areas, on-chip space and
off-chip space.
•
•
•
•
8-bit MOVX operations use the contents of EMI0CN to determine the high-byte of the effective address
and R0 or R1 to determine the low-byte of the effective address.
16-bit MOVX operations use the contents of the 16-bit DPTR to determine the effective address.
Effective addresses below the internal XRAM size boundary will access on-chip XRAM space.
Effective addresses above the internal XRAM size boundary will access off-chip space.
8-bit MOVX operations use the contents of EMI0CN to determine whether the memory access is
on-chip or off-chip. However, in the “No Bank Select” mode, an 8-bit MOVX operation will not drive the
upper 8-bits A[15:8] of the Address Bus during an off-chip access. This allows the user to manipulate
the upper address bits at will by setting the Port state directly via the port latches. This behavior is in
contrast with “Split Mode with Bank Select” described below. The lower 8-bits of the Address Bus
A[7:0] are driven, determined by R0 or R1.
16-bit MOVX operations use the contents of DPTR to determine whether the memory access is
on-chip or off-chip, and unlike 8-bit MOVX operations, the full 16-bits of the Address Bus A[15:0] are
driven during the off-chip transaction.
C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
Rev. 1.3
121
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