R5F21257SNFP#U0 Renesas Electronics America, R5F21257SNFP#U0 Datasheet - Page 20
R5F21257SNFP#U0
Manufacturer Part Number
R5F21257SNFP#U0
Description
IC R8C/25 MCU FLASH 52LQFP
Manufacturer
Renesas Electronics America
Series
R8C/2x/25r
Specifications of R5F21257SNFP#U0
Core Processor
R8C
Core Size
16/32-Bit
Speed
20MHz
Connectivity
I²C, LIN, SIO, SSU, UART/USART
Peripherals
POR, Voltage Detect, WDT
Number Of I /o
41
Program Memory Size
48KB (48K x 8)
Program Memory Type
FLASH
Ram Size
2.5K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 85°C
Package / Case
52-LQFP
For Use With
R0K521256S000BE - KIT EVAL STARTER FOR R8C/25
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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R8C/24 Group, R8C/25 Group
SINGLE-CHIP 16-BIT CMOS MCU
Rev.3.00
REJ09B0244-0300
1.
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series
CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements
sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of
executing instructions at high speed.
Furthermore, the R8C/25 Group has on-chip data flash (1 KB x 2 blocks).
The difference between the R8C/24 Group and R8C/25 Group is only the presence or absence of data flash. Their
peripheral functions are the same.
1.1
Electronic household appliances, office equipment, audio equipment, consumer products, etc.
Overview
Applications
Feb 29, 2008
Page 1 of 485
REJ09B0244-0300
Feb 29, 2008
Rev.3.00
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