MC9S12XEQ512CAL Freescale Semiconductor, MC9S12XEQ512CAL Datasheet - Page 1210

• Manufacturer Part Number: MC9S12XEQ512CAL
• Description: MCU 16BIT 512K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEQ512CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 32KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
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2
3
4
5
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1210
Num
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19
20
The values for thermal resistance are achieved by package simulations for the 9S12XEP100 die.
Measured per JEDEC JESD51-8. Measured on top surface of the board near the package.
Junction to ambient thermal resistance, θ
horizontal configuration in natural convection.
Junction to ambient thermal resistance, θ
horizontal configuration in natural convection.
Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by
MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package
is being used with a heat sink.
Thermal characterization parameter Ψ
case as defined in JESD51-2. Ψ
enviroment.
1
2
3
4
5
6
7
8
9
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Thermal resistance 208MAPBGA, single sided PCB
Thermal resistance208MAPBGA, double sided PCB
with 2 internal planes
Junction to Board 208MAPBGA
Junction to Case 208MAPBGA
Junction to Package Top 208MAPBGA
Thermal resistance LQFP144, single sided PCB
Thermal resistance LQFP144, double sided PCB
with 2 internal planes
Junction to Board LQFP 144
Junction to Case LQFP 144
Junction to Package Top LQFP144
Thermal resistance LQFP112, single sided PCB
Thermal resistance LQFP112, double sided PCB
with 2 internal planes
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal resistance QFP 80, single sided PCB
Thermal resistance QFP 80, double sided PCB
with 2 internal planes
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
Table A-5. Thermal Package Characteristics (9S12XEP100)
3
3
4
3
JT
Rating
is a useful value to use to estimate junction temperature in a steady state customer
MC9S12XE-Family Reference Manual , Rev. 1.23
5
4
JT
4
is the “resistance” from junction to reference point thermocouple on top center of the
JA
JA
4
2
6
was simulated to be equivalent to the JEDEC specification JESD51-2 in a
was simulated to be equivalent to the JEDEC specification JESD51-7 in a
5
5
5
208MAPBGA
LQFP144
LQFP112
3
QFP80
3
3
2
Symbol
Ψ
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JC
JA
JA
JB
JA
JA
JB
JA
JA
JB
JA
JA
JB
JT
JT
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Freescale Semiconductor
Max
7.4
53
31
20
41
32
22
43
32
22
45
33
19
11
9
2
3
7
3
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit