MC9S12XEQ512CAL Freescale Semiconductor, MC9S12XEQ512CAL Datasheet - Page 29

• Manufacturer Part Number: MC9S12XEQ512CAL
• Description: MCU 16BIT 512K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XEQ512CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 32KB
• Cpu Speed: 50MHz
• No. Of Timers: 3
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XE
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN, SCI, SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 25
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
•
•
•
•
•
•
•
— No external components required
— Configurable option to spread spectrum for reduced EMC radiation (frequency modulation)
CRG (clock and reset generation)
— COP watchdog
— Real time interrupt
— Clock monitor
— Fast wake up from STOP in self clock mode
Memory Options
— 128K, 256k, 384K, 512K, 768K and 1M byte Flash
— 2K, 4K byte emulated EEPROM
— 12K, 16K, 24K, 32K, 48K and 64K Byte RAM
Flash General Features
— 64 data bits plus 8 syndrome ECC (Error Correction Code) bits allow single bit failure
— Erase sector size 1024 bytes
— Automated program and erase algorithm
D-Flash Features
— Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access.
— Dedicated commands to control access to the D-Flash memory over EEE operation.
— Single bit fault correction and double bit fault detection within a word during read operations.
— Automated program and erase algorithm with verify and generation of ECC parity bits.
— Fast sector erase and word program operation.
— Ability to program up to four words in a burst sequence
Emulated EEPROM Features
— Automatic EEE file handling using an internal Memory Controller.
— Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset.
— Ability to monitor the number of outstanding EEE related buffer RAM words left to be
— Ability to disable EEE operation and allow priority access to the D-Flash memory.
— Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory.
Two 16-channel, 12-bit Analog-to-Digital Converters
— 8/10/12 Bit resolution
— 3µs, 10-bit single conversion time
— Left/right, signed/unsigned result data
— External and internal conversion trigger capability
— Internal oscillator for conversion in Stop modes
— Wake from low power modes on analog comparison > or <= match
Five MSCAN (1 M bit per second, CAN 2.0 A, B software compatible modules)
— Five receive and three transmit buffers
correction and double fault detection
programmed into D-Flash memory.
MC9S12XE-Family Reference Manual Rev. 1.23
Chapter 1 Device Overview MC9S12XE-Family
29