HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 10

IC H8S MCU FLASH 128K 100-TQFP

HD64F2218TF24

Manufacturer Part Number
HD64F2218TF24
Description
IC H8S MCU FLASH 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of HD64F2218TF24

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Item
1.2 Internal Block
Diagram
Figure 1.1 Internal
Block Diagram of
HD64F2218,
HD64F2218U,
HD64F2218CU
and HD642217CU
Figure 1.2 Internal
Block Diagram of
HD6432217
Figure 1.3 Internal
Block Diagram of
HD64F2212,
HD64F2212U,
HD64F2212CU,
HD64F2211,
HD64F2211U,
HD64F2211CU and
HD64F2210CU
Rev.7.00 Dec. 24, 2008 Page viii of liv
REJ09B0074-0700
Page
3
4
5
Revision (See Manual for Details)
Title and figure amended
Note *1 shown below deleted
Notes: 1. The FWE pin is provided only in the HD64F2218 and
Note amended
1. The FWE pin is provided only in the flash memory version.
Title and figure amended
Note *1 shown below deleted
Notes: 1. The FWE pin is provided only in the HD64F2212,
HD64F2218U.
HD64F2212U, HD64F2211 andHD64F2211U.
STBY
RES
NMI
FWE
USPND/TMOW
STBY
RES
NMI
FWE
USPND/TMOW
MD2
MD1
MD0
EXTAL
XTAL
PLLVCC
PLLVSS
OSC1
OSC2
MD2
MD1
MD0
EXTAL
XTAL
PLLVCC
PLLVSS
OSC1
OSC2
Boundary scan/H-UDI*
H-UDI/ports
Interrupts controll
7 and G*
Interrupts co
2
2

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