HD64F2218TF24 Renesas Electronics America, HD64F2218TF24 Datasheet - Page 55

• Manufacturer Part Number: HD64F2218TF24
• Description: IC H8S MCU FLASH 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2218TF24

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: 3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table 19.2
Table 19.3
Table 19.4
Section 20 Power-Down Modes
Table 20.1
Table 20.2
Table 20.3
Table 20.4
Section 22 Electrical Characteristics
Table 22.1
Table 22.2
Table 22.3
Table 22.4
Table 22.5
Table 22.6
Table 22.7
Table 22.8
Table 22.9
Table 22.10 Flash Memory Characteristics................................................................................ 683
Crystal Resonator Characteristics........................................................................... 600
External Clock Input Conditions ............................................................................ 601
External Clock Input Conditions when Duty Adjustment Circuit Is not Used....... 602
LSI Internal States in Each Mode........................................................................... 608
Transition Conditions of Power-Down Modes....................................................... 610
Oscillation Stabilization Time Settings .................................................................. 620
φ Pin State in Each Processing State ...................................................................... 627
Absolute Maximum Ratings................................................................................... 657
DC Characteristics.................................................................................................. 659
Permissible Output Currents................................................................................... 662
Clock Timing.......................................................................................................... 664
Control Signal Timing............................................................................................ 666
Bus Timing............................................................................................................. 668
Timing of On-Chip Supporting Modules ............................................................... 675
USB Characteristics (USD+ and USD- pins) when On-Chip USB Transceiver Is
Used........................................................................................................................ 680
A/D Conversion Characteristics ............................................................................. 682
Rev.7.00 Dec. 24, 2008 Page liii of liv
REJ09B0074-0700