D12363VF33V Renesas Electronics America, D12363VF33V Datasheet - Page 956

IC H8S/2363 MCU ROMLESS 128QFP

D12363VF33V

Manufacturer Part Number
D12363VF33V
Description
IC H8S/2363 MCU ROMLESS 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12363VF33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
YR0K42378FC000BA - KIT EVAL FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

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Company
Part Number
Manufacturer
Quantity
Price
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D12363VF33V
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ST
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67 000
Part Number:
D12363VF33V
Manufacturer:
Renesas Electronics America
Quantity:
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D12363VF33V
Manufacturer:
RENSAS
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Section 25 Electrical Characteristics
Rev.6.00 Mar. 18, 2009 Page 896 of 980
REJ09B0050-0600
Read
Write
DACK0, DACK1
Notes:
φ
A23 to A0
RAS3, RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
DACK timing: when DDS = 0
RAS timing: when RAST = 1
Figure 25.16 DRAM Access Timing: Three-State Access (RAST = 1)
t
AD
T
t
p
t
PCH1
AS2
t
CSD2
T
r
t
AH2
t
DACD1
t
t
t
WRD2
AD
WDD
T
c1
t
AC7
t
AS3
t
WCS2
t
t
WDS2
OED2
t
AA5
T
c2
t
CASD2
t
WCH2
t
CASW2
t
AC2
t
AH3
t
WDH3
T
c3
t
RDS2
t
WRD2
t
RDH2
t
t
OED1
CASD1
t
t
DACD2
CSD3

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