MC68HC11K0CFUE4 Freescale Semiconductor, MC68HC11K0CFUE4 Datasheet - Page 275

• Manufacturer Part Number: MC68HC11K0CFUE4
• Description: MCU 8-BIT 768 RAM 4MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC11K0CFUE4

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 37
• Program Memory Type: ROMless
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details

13.3 84-Pin Plastic-Leaded Chip Carrier (Case 780)
M68HC11K Family
MOTOROLA
C
-L-
Z
K1
K
0.007 (0.18)
0.007 (0.18)
84
G
VIEW S
S
S
A
R
T
T
1
L-M
L-M
-N-
F
H
S
S
2X
Freescale Semiconductor, Inc.
G1
N
N
For More Information On This Product,
0.007 (0.18)
0.007 (0.18)
S
S
V
J
Go to: www.freescale.com
S
S
-M-
T
T
Y
W
E
L-M
L-M
BRK
VIEW S
Mechanical Data
S
S
N
N
D
D
-T-
S
S
0.004 (0.10)
SEATING
PLANE
T
84-Pin Plastic-Leaded Chip Carrier (Case 780)
B
Z
NOTES:
1.
2.
3.
4.
5.
6.
7.
X
0.007 (0.18)
U
DATUMS L, M, AND N DETERMINED WHERE TOP OF LEAD
SHOULDER EXITS PACKAGE BODY AT MOLD PARTING LINE.
DIMENSION G1 TO BE MEASURED AT CLOSEST APPROACH
OF LEAD TO DATUM T, SEATING PLANE.
DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE.
DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE
BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP AND
BOTTOM OF THE PLASTIC BODY.
DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION
OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT
CAUSE THE H DIMENSION TO BE GREATER THAN 0.037
(0.94). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
VIEW D-D
0.007 (0.18)
DIM
G1 0.545
K1 0.060
R1 0.025
M
W 0.042
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
T
1.185
1.185
0.165
0.090
0.013
0.026
0.020
0.025
1.150
1.150
0.042
0.042
MIN
0.050 BSC
L-M
2
---
INCHES
M
84X R
2X
T
1.195 30.10
1.195 30.10
0.180
0.120
0.021
0.032
1.156 29.21
1.156 29.21
0.048
0.048
0.056
0.020
0.565 13.84
0.045
S
MAX
10
G1
---
---
---
L-M
N
R1
S
MILLIMETERS
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.52
0.64
S
MIN
1.27 BSC
2
---
N
Mechanical Data
30.35
30.35
29.36
29.36
14.35
S
MAX
4.57
3.05
0.53
0.81
1.21
1.21
1.42
0.50
1.14
10
Technical Data
---
---
---
275