MC68HC11K0CFUE4 Freescale Semiconductor, MC68HC11K0CFUE4 Datasheet - Page 279

• Manufacturer Part Number: MC68HC11K0CFUE4
• Description: MCU 8-BIT 768 RAM 4MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HC11r

Specifications of MC68HC11K0CFUE4

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 37
• Program Memory Type: ROMless
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details

13.7 68-Pin Plastic Leaded Chip Carrier (Case 779)
M68HC11K Family
MOTOROLA
-L-
C
Z
K1
K
VIEW S
0.010
68
G
S
F
H
G1
T
A
R
L-M
0.007
0.007
1
-N-
S
Freescale Semiconductor, Inc.
N
M
M
S
For More Information On This Product,
T
T
L-M
L-M
S
VIEW S
V
0.007
S
0.007
Y
J
N
Go to: www.freescale.com
E
-M-
N
BRK
W
S
S
M
M
D
D
Mechanical Data
T
-T-
T
L-M
0.004
L-M
SEATING
PLANE
S
S
N
N
DIM
G1 0.910
K1 0.040
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
S
S
0.985
0.985
0.165
0.090
0.013
0.026
0.020
0.025
0.950
0.950
0.042
0.042
0.042
MIN
0.050 BSC
2
---
INCHES
0.995
0.995
0.180
0.110
0.019
0.032
0.956
0.956
0.048
0.048
0.056
0.020
0.930
MAX
68-Pin Plastic Leaded Chip Carrier (Case 779)
10
---
---
---
B
Z
U
0.007
X
VIEW D-D
NOTES:
1.
2.
3.
4.
5.
6.
7.
0.007
M
DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM T, SEATING PLANE.
DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 PER
SIDE.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012.
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC
BODY EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD FLASH,
BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037. THE
DAMBAR INTRUSION(S) SHALL NOT CAUSE THE
H DIMENSION TO BE SMALLER THAN 0.025.
T
M
L-M
T
L-M
S
0.010
G1
N
S
S
N
S
S
T
Mechanical Data
L-M
Technical Data
S
N
S
279