MCF5216CVF66J Freescale Semiconductor, MCF5216CVF66J Datasheet - Page 600

• Manufacturer Part Number: MCF5216CVF66J
• Description: IC MCU 512K FLASH 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF521xr

Specifications of MCF5216CVF66J

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: CAN, EBI/EMI, I²C, SPI, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 142
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Processor Series: MCF521x
• Core: ColdFire V2
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: M52210DEMO, M52211EVB
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

Queued Analog-to-Digital Converter (QADC)
Other suggestions for PCB layout in which the QADC is employed include:
28.9.5
Positive or negative stress refers to conditions which exceed nominally defined operating limits. Examples
include applying a voltage exceeding the normal limit on an input (for example, voltages outside of the
suggested supply/reference ranges) or causing currents into or out of the pin which exceed normal limits.
QADC specific considerations are voltages greater than V
which cause excessive currents into or out of the input. Refer to
for more information on exact magnitudes.
Either stress conditions can potentially disrupt conversion results on neighboring inputs. Parasitic devices,
associated with CMOS processes, can cause an immediate disruptive influence on neighboring pins.
Common examples of parasitic devices are diodes to substrate and bipolar devices with the base terminal
tied to substrate (V
cause errors on the selected channel by developing a voltage drop across the selected channel’s
impedances.
28-62
•
•
•
•
•
Analog ground must be low impedance to all analog ground points in the circuit.
Bypass capacitors should be as close to the power pins as possible.
The analog ground should be isolated from the digital ground. This can be done by cutting a
separate ground plane for the analog ground.
Non-minimum traces should be utilized for connecting bypass capacitors and filters to their
corresponding ground/power points.
Minimum distance for trace runs when possible.
Accommodating Positive/Negative Stress Conditions
PCB
+5 V
SS
/V
Figure 28-49. Star-Ground at the Point of Power Supply Origin
SSA
Analog Power Supply
MCF5282 and MCF5216 ColdFire Microcontroller User’s Manual, Rev. 3
ground). Under stress conditions, current injected on an adjacent signal can
AGND
QADC
+5 V
V
V
DD
SS
DDA
or less than V
Chapter 33, “Electrical
PGND
Digital Power Supply
SSA
applied to an analog input
+5 V
Freescale Semiconductor
Characteristics”