DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 446

IC H8S MCU FLASH 3V 384K 144LQFP

DF2377RVFQ33W

Manufacturer Part Number
DF2377RVFQ33W
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2377RVFQ33W

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2377RVFQ33W
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 8 EXDMA Controller (EXDMAC)
Rev.7.00 Mar. 18, 2009 page 378 of 1136
REJ09B0109-0700
Transfer from external memory to external device with DACK
Transfer from external device with DACK to external memory
φ
Address bus
RD
WR
EDACK
Data bus
ETEND
φ
Address bus
RD
WR
EDACK
Data bus
ETEND
Figure 8.4 Example of Timing in Single Address Mode
EXDMA cycle
EXDMA cycle
EDSAR
EDDAR
Address to external memory space
RD signal to external memory space
Data output from external memory
Address to external memory space
WR signal to external memory space
Data output from external device
with DACK

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