DF2377RVFQ33W Renesas Electronics America, DF2377RVFQ33W Datasheet - Page 984

IC H8S MCU FLASH 3V 384K 144LQFP

DF2377RVFQ33W

Manufacturer Part Number
DF2377RVFQ33W
Description
IC H8S MCU FLASH 3V 384K 144LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2377RVFQ33W

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2377RVFQ33W
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2377RVFQ33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 21 Flash Memory (0.18-μm F-ZTAT Version)
Table 21.8 (3)
Rev.7.00 Mar. 18, 2009 page 916 of 1136
REJ09B0109-0700
Storage Area for
Program Data
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for Settings
of Initial Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine
Operation for Interrupt
Inhibit
Switching MATs by
FMATS
Operation for Writing
H'5A to FKEY
Item
Useable Area for Programming in User Boot Mode
On-chip
RAM
Storable/Executable Area
Boot
User
MAT
× *
×
×
×
×
×
1
(Expanded
External
Space
Mode)
×
×
×
User
MAT
Selected MAT
Boot
User
MAT
Storage Area
Embedded
Program

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