PIC18LF2539T-I/SO Microchip Technology, PIC18LF2539T-I/SO Datasheet - Page 6

• Manufacturer Part Number: PIC18LF2539T-I/SO
• Description: IC MCU FLASH 12KX16 EE AD 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18LF2539T-I/SO

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 24KB (12K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 1408 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1408 B
• Interface Type: I2C, SPI, AUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 16 bit
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: DV164005, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC18FXX39
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer0 Module ........................................................................................................................................................................... 99
11.0 Timer1 Module ......................................................................................................................................................................... 103
12.0 Timer2 Module ......................................................................................................................................................................... 107
13.0 Timer3 Module ......................................................................................................................................................................... 109
14.0 Single Phase Induction Motor Control Kernel .......................................................................................................................... 113
15.0 Pulse Width Modulation (PWM) Modules ................................................................................................................................. 123
16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 125
17.0 Addressable Universal Synchronous Asynchronous Receiver Transmitter (USART).............................................................. 165
18.0 Compatible 10-bit Analog-to-Digital Converter (A/D) Module................................................................................................... 181
19.0 Low Voltage Detect .................................................................................................................................................................. 189
20.0 Special Features of the CPU .................................................................................................................................................... 195
21.0 Instruction Set Summary .......................................................................................................................................................... 211
22.0 Development Support............................................................................................................................................................... 253
23.0 Electrical Characteristics .......................................................................................................................................................... 259
24.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 287
25.0 Packaging Information.............................................................................................................................................................. 297
Appendix A: Revision History............................................................................................................................................................. 305
Appendix B: Device Differences......................................................................................................................................................... 305
Appendix C: Conversion Considerations ........................................................................................................................................... 306
Appendix D: Migration from High-End to Enhanced Devices............................................................................................................. 307
Index .................................................................................................................................................................................................. 309
On-Line Support................................................................................................................................................................................. 317
Systems Information and Upgrade Hot Line ...................................................................................................................................... 317
Reader Response .............................................................................................................................................................................. 318
PIC18FXX39 Product Identification System....................................................................................................................................... 319
DS30485A-page 4
Device Overview .......................................................................................................................................................................... 7
Oscillator Configurations ............................................................................................................................................................ 19
Reset .......................................................................................................................................................................................... 23
Memory Organization ................................................................................................................................................................. 33
FLASH Program Memory ........................................................................................................................................................... 51
Data EEPROM Memory ............................................................................................................................................................. 61
8 X 8 Hardware Multiplier ........................................................................................................................................................... 67
Interrupts .................................................................................................................................................................................... 69
I/O Ports ..................................................................................................................................................................................... 83
Preliminary
 2002 Microchip Technology Inc.