PIC18F2510-E/SP Microchip Technology, PIC18F2510-E/SP Datasheet - Page 23
PIC18F2510-E/SP
Manufacturer Part Number
PIC18F2510-E/SP
Description
IC MCU FLASH 16KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18LF2410-ISO.pdf
(376 pages)
4.PIC18LF2410-ISO.pdf
(8 pages)
5.PIC18LF2410-ISO.pdf
(16 pages)
6.PIC18LF2410-ISO.pdf
(6 pages)
7.PIC18LF2410-ISO.pdf
(6 pages)
8.PIC18LF2410-ISO.pdf
(8 pages)
Specifications of PIC18F2510-E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18LF2410-ISO PDF datasheet #3
- PIC18LF2410-ISO PDF datasheet #4
- PIC18LF2410-ISO PDF datasheet #5
- PIC18LF2410-ISO PDF datasheet #6
- PIC18LF2410-ISO PDF datasheet #7
- PIC18LF2410-ISO PDF datasheet #8
- Current page: 23 of 376
- Download datasheet (7Mb)
2.0
2.1
PIC18F2X1X/4X1X devices can be operated in ten
different oscillator modes. The user can program the
Configuration bits, FOSC3:FOSC0, in Configuration
Register 1H to select one of these ten modes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. ECIO
2.2
In XT, LP, HS or HSPLL Oscillator modes, a crystal or
ceramic resonator is connected to the OSC1 and
OSC2 pins to establish oscillation. Figure 2-1 shows
the pin connections.
The oscillator design requires the use of a parallel cut
crystal.
© 2009 Microchip Technology Inc.
Note:
LP
XT
HS
HSPLL High-Speed Crystal/Resonator
RC
RCIO
INTIO1 Internal Oscillator with F
INTIO2 Internal Oscillator with I/O on RA6
EC
OSCILLATOR
CONFIGURATIONS
Oscillator Types
Crystal Oscillator/Ceramic
Resonators
frequency out of the crystal manufacturer’s
Use of a series cut crystal may give a
specifications.
Low-Power Crystal
Crystal/Resonator
High-Speed Crystal/Resonator
with PLL enabled
External Resistor/Capacitor with
F
External Resistor/Capacitor with I/O
on RA6
on RA6 and I/O on RA7
and RA7
External Clock with F
External Clock with I/O on RA6
OSC
/4 output on RA6
OSC
OSC
/4 output
/4 output
FIGURE 2-1:
TABLE 2-1:
Capacitor values are for design guidance only.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes following Table 2-2 for additional
information.
Note 1: See Table 2-1 and Table 2-2 for initial values of
DD
Note:
Mode
XT
and temperature range for the application.
PIC18F2X1X/4X1X
C1
C2
2: A series resistor (R
3: R
(1)
(1)
Typical Capacitor Values Used:
C1 and C2.
strip cut crystals.
When using resonators with frequencies
above 3.5 MHz, the use of HS mode,
rather than XT mode, is recommended.
HS mode may be used at any V
which the controller is rated. If HS is
selected, it is possible that the gain of the
oscillator will overdrive the resonator.
Therefore, a series resistor should be
placed between the OSC2 pin and the
resonator. As a good starting point, the
recommended value of R
F
3.58 MHz
4.19 MHz
XTAL
R
varies with the oscillator mode chosen.
4 MHz
4 MHz
S
Freq
(2)
CAPACITOR SELECTION FOR
CERAMIC RESONATORS
OSC2
OSC1
CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, LP, HS OR HSPLL
CONFIGURATION)
S
OSC1
15 pF
15 pF
30 pF
50 pF
) may be required for AT
R
F
(3)
DS39636D-page 25
S
PIC18FXXXX
is 330Ω.
Sleep
To
OSC2
15 pF
15 pF
30 pF
50 pF
Internal
Logic
DD
for
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