PIC18F2510-E/SP Microchip Technology, PIC18F2510-E/SP Datasheet - Page 358
![IC MCU FLASH 16KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F2510-E/SP
Manufacturer Part Number
PIC18F2510-E/SP
Description
IC MCU FLASH 16KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18LF2410-ISO.pdf
(376 pages)
4.PIC18LF2410-ISO.pdf
(8 pages)
5.PIC18LF2410-ISO.pdf
(16 pages)
6.PIC18LF2410-ISO.pdf
(6 pages)
7.PIC18LF2410-ISO.pdf
(6 pages)
8.PIC18LF2410-ISO.pdf
(8 pages)
Specifications of PIC18F2510-E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
32KB (16K x 16)
Program Memory Type
FLASH
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
- PIC16F616T-ISL PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18LF2410-ISO PDF datasheet #3
- PIC18LF2410-ISO PDF datasheet #4
- PIC18LF2410-ISO PDF datasheet #5
- PIC18LF2410-ISO PDF datasheet #6
- PIC18LF2410-ISO PDF datasheet #7
- PIC18LF2410-ISO PDF datasheet #8
- Current page: 358 of 376
- Download datasheet (7Mb)
PIC18F2X1X/4X1X
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS39636D-page 360
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
NOTE 1
e
b
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
φ
E1
Units
A2
A1
E1
D1
L
L1
D
N
A
E
α
NOTE 2
e
L
φ
c
b
β
E
A1
A
MIN
0.95
0.05
0.45
0.09
0.30
11°
11°
0°
–
MILLIMETERS
L1
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.80 BSC
1.00 REF
NOM
1.00
0.60
0.37
3.5°
12°
12°
44
–
–
–
Microchip Technology Drawing C04-076B
© 2009 Microchip Technology Inc.
α
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13°
13°
7°
A2
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