DSP56F807VF80 Freescale Semiconductor, DSP56F807VF80 Datasheet - Page 22

• Manufacturer Part Number: DSP56F807VF80
• Description: IC DSP 80MHZ 60K FLASH 160-BGA
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxr

Specifications of DSP56F807VF80

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 136KB (68K x 16)
• Program Memory Type: FLASH
• Ram Size: 6K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 160-MAPBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Notes:
22
1.
2.
3.
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to case
Junction to center of case
I/O pin power dissipation
Power dissipation
Junction to center of case
Voltage difference V
ADC reference voltage
Ambient operating temperature
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
Junction to ambient thermal resistance, Theta-JA (
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where “s” is the number of signal layers and “p” is the
number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with
the non-single layer boards is Theta-JMA.
Junction to case thermal resistance, Theta-JC (R
using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
Characteristic
Characteristic
SS
to V
Table 3-2 Recommended Operating Conditions
SSA
Table 3-3 Thermal Characteristics
56F807 Technical Data Technical Data, Rev. 16
Four layer
board (2s2p)
Four layer
board (2s2p)
Comments
θJC
Symbol
VREF
ΔV
R
Symbol
T
), was simulated to be equivalent to the measured values
P
(2s2p)
R
R
R
θJA
A
SS
R
R
P
Ψ
DMAX
P
θJMA
θJMA
θJMA
θJA
θJC
I/O
JT
) was simulated to be equivalent to the JEDEC
D
P
160-pin
Min
-0.1
–40
2.7
LQFP
D
38.5
35.4
31.5
8.6
0.8
33
User Determined
= (I
(TJ - TA) /R
DD
Value
x V
6
Typ
DD
–
–
MBGA
-
θ
63.4
60.3
49.9
46.8
160
+ P
8.1
0.6
JA
I/O
)
V
Max
0.1
85
Freescale Semiconductor
DDA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
W
W
W
Unit
Notes
°C
V
V
4, 5
1,2
1,2
2
2
3
7