DSP56F807VF80 Freescale Semiconductor, DSP56F807VF80 Datasheet - Page 52

• Manufacturer Part Number: DSP56F807VF80
• Description: IC DSP 80MHZ 60K FLASH 160-BGA
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxr

Specifications of DSP56F807VF80

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 136KB (68K x 16)
• Program Memory Type: FLASH
• Ram Size: 6K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 160-MAPBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Please see www.freescale.com for the most current case outline.
52
13X
160X
e
X
3
S
Y
E
b
0.30
0.10 Z
14 13 12 11 10
Z
X
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
Y
0.20
Figure 4-3 160 MAPBGA Mechanical Information
VIEW M-M
9
D
56F807 Technical Data Technical Data, Rev. 16
6
13X
S
5
e
4
3
2
1
CASE 1268-01
G
H
K
M
ISSUE O
A
B
C
D
E
F
L
N
P
J
METALIZED MARK FOR
PIN 1 IDENTIFICATION
IN THIS AREA
K
M
A
A2
A1
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
Z
DETAIL K
DIM MIN
A1
A2
A
b
D
E
S
e
MILLIMETERS
°
4
1.32
0.27
0.35
15.00 BSC
15.00 BSC
1.00 BSC
0.50 BSC
1.18 REF
Freescale Semiconductor
MAX
1.75
0.47
0.65
0.15 Z
160X
5
0.30 Z