MCF5272CVM66 Freescale Semiconductor, MCF5272CVM66 Datasheet - Page 13
MCF5272CVM66
Manufacturer Part Number
MCF5272CVM66
Description
IC MPU 66MHZ COLDFIRE 196-MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Specifications of MCF5272CVM66
Core Processor
Coldfire V2
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals
DMA, WDT
Number Of I /o
32
Program Memory Size
16KB (4K x 32)
Program Memory Type
ROM
Ram Size
1K x 32
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
196-MAPBGA
Cpu Speed
66MHz
Embedded Interface Type
UART, QSPI, USB, TDM
Digital Ic Case Style
BGA
No. Of Pins
196
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
66MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
196
Package Type
MA-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant
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Paragraph
Number
1.1 MCF5272 Key Features ................................................................................................................. 1-1
1.2 MCF5272 Architecture .................................................................................................................. 1-4
1.3
1.4 MCF5272-Specific Features .......................................................................................................... 1-7
2.1 Features and Enhancements ........................................................................................................... 2-1
2.2 Programming Model ...................................................................................................................... 2-4
Freescale Semiconductor
1.2.1 Version 2 ColdFire Core ..................................................................................................... 1-4
1.2.2 System Integration Module (SIM) ...................................................................................... 1-5
1.2.3 UART Module .................................................................................................................... 1-6
1.2.4 Timer Module ..................................................................................................................... 1-7
1.2.5 Test Access Port ................................................................................................................. 1-7
1.3.1 System Bus Configuration .................................................................................................. 1-7
1.4.1 Physical Layer Interface Controller (PLIC) ....................................................................... 1-7
1.4.2 Pulse-Width Modulation (PWM) Unit ............................................................................... 1-8
1.4.3 Queued Serial Peripheral Interface (QSPI) ........................................................................ 1-8
1.4.4 Universal Serial Bus (USB) Module .................................................................................. 1-8
2.1.1 Decoupled Pipelines ........................................................................................................... 2-1
2.1.2 Debug Module Enhancements ............................................................................................ 2-4
2.2.1 User Programming Model .................................................................................................. 2-4
System Design .............................................................................................................................. 1-7
1.2.2.1 External Bus Interface .......................................................................................... 1-5
1.2.2.2 Chip Select and Wait State Generation ................................................................. 1-5
1.2.2.3 System Configuration and Protection ................................................................... 1-5
1.2.2.4 Power Management .............................................................................................. 1-6
1.2.2.5 Parallel Input/Output Ports ................................................................................... 1-6
1.2.2.6 Interrupt Inputs ..................................................................................................... 1-6
2.1.1.1 Instruction Fetch Pipeline (IFP) ............................................................................ 2-2
2.1.1.2 Operand Execution Pipeline (OEP) ...................................................................... 2-2
2.2.1.1 Data Registers (D0–D7) ....................................................................................... 2-5
2.1.1.2.1 Illegal Opcode Handling .............................................................................. 2-3
2.1.1.2.2 Hardware Multiply/Accumulate (MAC) Unit.............................................. 2-3
2.1.1.2.3 Hardware Divide Unit.................................................................................. 2-4
MCF5272 ColdFire
Table of Contents
®
Integrated Microprocessor User’s Manual, Rev. 3
ColdFire Core
Chapter 1
Chapter 2
Overview
Title
Number
Page
xiii
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