SX1212IWLTRT Semtech, SX1212IWLTRT Datasheet - Page 4

• Manufacturer Part Number: SX1212IWLTRT
• Description: IC TXRX 300MHZ-510MHZ 32-TQFN
• Manufacturer: Semtech

Specifications of SX1212IWLTRT

• Frequency: 300MHz ~ 510MHz
• Data Rate - Maximum: 150kbps
• Modulation Or Protocol: FSK, OOK
• Applications: AMR, ISM, Home Automation, Process Control
• Power - Output: 12.5dBm
• Sensitivity: -110dBm
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 3mA
• Current - Transmitting: 25mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-TQFN
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Modulation Type: FSK/OOK
• Package Type: TQFN EP
• Operating Supply Voltage (min): 2.1V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: SX1212IWLTR

Index of Tables
Table 1: Ordering Information ........................................................ 1
Table 2: SX1212 Pinouts ............................................................... 7
Table 3: Absolute Maximum Ratings ............................................. 8
Table 4: Operating Range.............................................................. 8
Table 5: Power Consumption Specification ................................... 8
Table 6: Frequency Synthesizer Specification............................... 9
Table 7: Transmitter Specification ................................................. 9
Table 8: Receiver Specification.................................................... 10
Table 9: Digital Specification........................................................ 11
Table 10: MCParam_Freq_band Setting ..................................... 15
Table 11: PA Rise/Fall Times....................................................... 20
Table 12: Operating Modes ......................................................... 33
Table 13: Pin Configuration vs. Chip Mode ................................. 33
Table 14: Data Operation Mode Selection ................................... 35
Table 15: Config vs. Data SPI Interface Selection ....................... 36
Table 16: Status of FIFO when Switching Between Different
Table 17: Interrupt Mapping in Continuous Rx Mode .................. 42
Table 18: Interrupt Mapping in Continuous Tx Mode................... 42
Acronyms
Rev 2 – June 18th, 2009
ADVANCED COMMUNICATIONS & SENSING
BOM
BR
BW
CCITT
CP
CRC
DAC
DDS
DLL
ERP
ETSI
FCC
Fdev
FIFO
FS
FSK
GUI
IC
ID
IF
IRQ
ITU
LFSR
LNA
Modes of the Chip ............................................................. 39
Bill Of Materials
First In First Out
Frequency Shift Keying
Graphical User Interface
Intermediate Frequency
Bit Rate
Bandwidth
Comité Consultatif International
Téléphonique et Télégraphique - ITU
Charge Pump
Cyclic Redundancy Check
Digital to Analog Converter
Direct Digital Synthesis
Dynamically Linked Library
Equivalent Radiated Power
European Telecommunications Standards
Institute
Federal Communications Commission
Frequency Deviation
Frequency Synthesizer
Integrated Circuit
IDentificator
Interrupt ReQuest
International Telecommunication Union
Linear Feedback Shift Register
Low Noise Amplifier
Page 4 of 77
Table 19: Relevant Configuration Registers in Continuous Mode
Table 20: Interrupt Mapping in Buffered Rx and Stby Modes .......46
Table 21: Interrupt Mapping in Tx Buffered Mode ........................46
Table 22: Relevant Configuration Registers in Buffered Mode (data
Table 23: Interrupt Mapping in Rx and Stby in Packet Mode........55
Table 24: Interrupt Mapping in Tx Packet Mode ...........................55
Table 25: Relevant Configuration Registers in Packet Mode (data
Table 26: Registers List ................................................................58
Table 27: MCParam Register Description ....................................58
Table 28: IRQParam Register Description....................................60
Table 29: RXParam Register Description .....................................62
Table 30: SYNCParam Register Description ................................63
Table 31: TXParam Register Description .....................................64
Table 32: OSCParam Register Description ..................................64
Table 33: PKTParam Register Description ...................................65
Table 34: Crystal Resonator Specification....................................66
Table 35: Reference Design BOM ................................................74
LO
LSB
MSB
NRZ
NZIF
OOK
PA
PCB
PFD
PLL
POR
RBW
RF
RSSI
Rx
SAW
SPI
SR
Stby
Tx
uC
VCO
XO
XOR
(data processing related only)............................................43
processing related only) .....................................................47
processing related only) .....................................................56
Local Oscillator
Least Significant Bit
Most Significant Bit
Non Return to Zero
Near Zero Intermediate Frequency
On Off Keying
Power Amplifier
Printed Circuit Board
Phase Frequency Detector
Phase-Locked Loop
Power On Reset
Resolution BandWidth
Radio Frequency
Received Signal Strength Indicator
Receiver
Surface Acoustic Wave
Serial Peripheral Interface
Shift Register
Standby
Transmitter
Microcontroller
Voltage Controlled Oscillator
Crystal Oscillator
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