A3PE1500-PQG208 Actel, A3PE1500-PQG208 Datasheet - Page 17

• Manufacturer Part Number: A3PE1500-PQG208
• Description: FPGA - Field Programmable Gate Array 1500K System Gates
• Manufacturer: Actel

Specifications of A3PE1500-PQG208

• Processor Series: A3PE1500
• Core: IP Core
• Maximum Operating Frequency: 231 MHz
• Number Of Programmable I/os: 147
• Data Ram Size: 276480
• Supply Voltage (max): 1.575 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Development Tools By Supplier: A3PE-Proto-Kit, A3PE-Brd1500-Skt, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, FlashPro 4, FlashPro 3, FlashPro Lite
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 1.5 M
• Package / Case: PQFP-208
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 2-5 • Package Thermal Resistivities
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays
Package Type
Plastic Quad Flat Package (PQFP)
Plastic Quad Flat Package (PQFP) with
embedded heat spreader
Fine Pitch Ball Grid Array (FBGA)
Array Voltage
Maximum Power Allowed
VCC (V)
1.425
1.500
1.575
(normalized to T
Thermal Characteristics
Introduction
The temperature variable in Actel Designer software refers to the junction temperature, not the ambient
temperature. This is an important distinction because dynamic and static power consumption cause the
chip junction to be higher than the ambient temperature.
EQ 1
where:
T
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
θ
temperature is 110°C.
allowed for an 896-pin FBGA package at commercial temperature and in still air.
Temperature and Voltage Derating Factors
A
ja
ja
. The thermal characteristics for θ
= Ambient Temperature
= Junction-to-ambient of the package. θ
T
J
can be used to calculate junction temperature.
= Junction Temperature = ΔT + T
–40°C
0.87
0.83
0.80
=
J
Max. junction temp. (°C) Max. ambient temp. (°C)
-------------------------------------------------------------------------------------------------------------------------------------- -
= 70°C, VCC = 1.425 V)
EQ 2
0.92
0.88
0.85
0°C
Pin Count
shows a sample calculation of the absolute maximum power dissipation
208
208
256
484
676
896
ja
are shown for two air flow rates. The absolute maximum junction
θ
A
Junction Temperature (°C)
ja
(°C/W)
25°C
ja
0.95
0.90
0.87
–
R e v i s i o n 9
numbers are located in
8.0
3.8
3.8
3.2
3.2
2.4
θ
jc
jc
and the junction-to-ambient air thermal resistivity is
Still Air
26.1
16.2
26.9
20.5
16.4
13.6
70°C
1.00
0.95
0.92
200 ft./min.
Table
22.5
13.3
22.8
17.0
13.0
10.4
=
110°C 70°C
------------------------------------
θ
ja
ja
13.6°C/W
2-5.
* P
ProASIC3E Flash Family FPGAs
85°C
1.02
0.97
0.93
–
500 ft./min.
21.5
15.9
12.0
20.8
11.9
9.4
=
5.88 W
100°C
1.04
0.98
0.95
Units
C/W
C/W
C/W
C/W
C/W
C/W
EQ 1
EQ 2
2 -5