XC3S1600E-5FG320C Xilinx Inc, XC3S1600E-5FG320C Datasheet - Page 180

• Manufacturer Part Number: XC3S1600E-5FG320C
• Description: PROGRAMMABLE MICROCHIP
• Manufacturer: Xilinx Inc

Table 29: FG400 Package Pinout
Table 30: User I/Os Per Bank for the XC3S250E and XC3S500E in the FG400 Package
Footprint Migration Differences
The XC3S1200E and XC3S1600E FPGAs have identical
footprints in the FG400 package. Designs can migrate
DS312-4 (v1.1) March 21, 2005
Advance Product Specification
Top
Right
Bottom
Left
TOTAL
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
Bank
Package
Edge
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
R
I/O Bank
XC3S1200E
XC3S1600E
Pin Name
0
1
2
3
Maximum
304
I/O
78
74
78
74
FG400
M11
Ball
K11
J10
J12
L10
L12
M9
K9
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
Type
156
I/O
43
35
30
48
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Table 29: FG400 Package Pinout
User I/Os by Bank
Table 30
distributed between the four I/O banks on the FG400 pack-
age.
between the XC3S1200E and XC3S1600E FPGAs without
further consideration.
VCCINT
VCCINT
VCCINT
VCCINT
INPUT
Bank
20
12
18
12
62
All Possible I/O Pins by Type
indicates how the 304 available user-I/O pins are
VCCINT
VCCINT
VCCINT
VCCINT
DUAL
XC3S1200E
XC3S1600E
21
24
46
Pin Name
1
0
VREF
24
6
6
6
6
Pinout Descriptions
FG400
M13
Ball
N10
N12
N8
GCLK
VCCINT
VCCINT
VCCINT
VCCINT
16
8
0
0
8
Type
59