SPP12N50C3 Infineon Technologies, SPP12N50C3 Datasheet - Page 2

MOSFET N-CH 560V 11.6A TO-220

SPP12N50C3

Manufacturer Part Number
SPP12N50C3
Description
MOSFET N-CH 560V 11.6A TO-220
Manufacturer
Infineon Technologies
Series
CoolMOS™r
Datasheet

Specifications of SPP12N50C3

Package / Case
TO-220-3 (Straight Leads)
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
380 mOhm @ 7A, 10V
Drain To Source Voltage (vdss)
560V
Current - Continuous Drain (id) @ 25° C
11.6A
Vgs(th) (max) @ Id
3.9V @ 500µA
Gate Charge (qg) @ Vgs
49nC @ 10V
Input Capacitance (ciss) @ Vds
1200pF @ 25V
Power - Max
125W
Mounting Type
Through Hole
Minimum Operating Temperature
- 55 C
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.38 Ohm @ 10 V
Drain-source Breakdown Voltage
500 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
11.6 A
Power Dissipation
125000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
SP000014459
SPP12N50C3IN
SPP12N50C3X
SPP12N50C3XK
SPP12N50C3XTIN
SPP12N50C3XTIN

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SPP12N50C3
Manufacturer:
INFINEON
Quantity:
5 000
Part Number:
SPP12N50C3
Manufacturer:
Infineon
Quantity:
500
Part Number:
SPP12N50C3
Manufacturer:
INFINEON/英飞凌
Quantity:
20 000
Maximum Ratings
Parameter
Drain Source voltage slope
V
Thermal Characteristics
Parameter
Thermal resistance, junction - case
Thermal resistance, junction - case, FullPAK
Thermal resistance, junction - ambient, leaded
Thermal resistance, junction - ambient, FullPAK
SMD version, device on PCB:
@ min. footprint
@ 6 cm
Soldering temperature, wavesoldering
1.6 mm (0.063 in.) from case for 10s
Rev. 3.1
Electrical Characteristics, at T j =25°C unless otherwise specified
Parameter
Drain-source breakdown voltage V
Drain-Source avalanche
breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance R
Gate input resistance
DS
= 400 V, I
2
cooling area
D
= 11.6 A, T
3)
j
= 125 °C
V
V
I
I
R
Symbol
DSS
GSS
(BR)DSS V
(BR)DS
GS(th)
DS(on)
G
4)
V
I
V
T
T
V
V
T
T
f=1MHz, open drain
D
Page 2
j
j
j
j
GS
GS
DS
GS
GS
=25°C
=150°C
=25°C
=150°C
=500µA, V GS =V DS
Conditions
=500V, V
=0V, I
=0V, I
=20V, V
=10V, I
Symbol
d v /d t
Symbol
R
R
R
R
R
T
D
D
D
sold
=0.25mA
=11.6A
thJC
thJC_FP
thJA
thJA_FP
thJA
DS
=7A
GS
=0V
SPI12N50C3, SPA12N50C3
=0V,
min.
min.
500
2.1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Values
Values
Value
0.34
0.92
typ.
typ.
600
0.1
1.4
50
35
3
-
-
-
-
-
-
-
-
-
SPP12N50C3
2009-11-30
max.
max.
0.38
260
100
100
3.8
3.9
62
80
62
1
1
-
-
-
-
-
Unit
V/ns
Unit
K/W
°C
Unit
V
µA
nA

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