MT48H16M16LFBF-75:H TR Micron Technology Inc, MT48H16M16LFBF-75:H TR Datasheet - Page 13

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MT48H16M16LFBF-75:H TR

Manufacturer Part Number
MT48H16M16LFBF-75:H TR
Description
DRAM Chip Mobile SDRAM 256M-Bit 16Mx16 1.8V 54-Pin VFBGA T/R
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet

Specifications of MT48H16M16LFBF-75:H TR

Package
54VFBGA
Density
256 Mb
Address Bus Width
15 Bit
Operating Supply Voltage
1.8 V
Maximum Clock Rate
133 MHz
Maximum Random Access Time
8|6 ns
Operating Temperature
0 to 70 °C
Package Dimensions
Figure 5: 54-Ball VFBGA (8mm x 9mm)
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
Ø0.4 SMD ball pads.
Dimensions apply
material: SAC105.
post-reflow
to solder balls
6.4 CTR
54X Ø0.45
Seating
plane
Solder ball
0.1 A
0.8 TYP
on
Note:
A
9
1. All dimensions are in millimeters.
8
7
6.4 CTR
8 ±0.1
0.8 TYP
3
2
1
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
0.65 ±0.05
A
B
C
D
E
F
G
H
J
13
9 ±0.1
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID

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