PIC18F2221-E/ML Microchip Technology, PIC18F2221-E/ML Datasheet - Page 338

• Manufacturer Part Number: PIC18F2221-E/ML
• Description: 4KB, Flash, 512bytes-RAM, 25I/O, 8-bit Family,nanoWatt 28 QFN 6x6mm TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2221-E/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 4KB (2K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PIC18F2221/2321/4221/4321 FAMILY
27.2
DS39689F-page 338
PIC18LF2221/2321/4221/4321
PIC18F2221/2321/4221/4321
Legend:
Note 1:
Param
No.
(Industrial)
(Industrial, Extended)
2:
3:
4:
5:
DC Characteristics:
Supply Current (I
Shading of rows is to assist in readability of the table.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.
BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
Extended Devices Only
Extended Devices Only 0.88
PIC18LF2X21/4X21
PIC18LF2X21/4X21
PIC18LF2X21/4X21 0.31
PIC18LF2X21/4X21 0.55
Device
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
All Devices
All Devices
DD
DD
)
(2)
; WDT enabled/disabled as specified.
DD
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Power-Down and Supply Current
PIC18F2221/2321/4221/4321 (Industrial)
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)
0.31
0.31
0.51
0.47
0.94
0.88
Typ
measurements in active operation mode are:
104
1.0
13
41
34
27
86
67
68
13
13
Max
0.35
0.35
0.35
0.60
0.60
0.60
100
115
1.3
1.3
1.2
1.2
19
19
17
45
38
30
95
75
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
μA
μA
μA
μA
μA
μA
μA
μA
μA
μA
+125°C
+125°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
-40°C
-40°C
-40°C
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
A
A
A
≤ +85°C for industrial
≤ +85°C for industrial
≤ +125°C for extended
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
= 2.0V
= 3.0V
= 5.0V
= 2.0V
= 3.0V
= 5.0V
Conditions
© 2009 Microchip Technology Inc.
DD
or V
SS
DD
(RC_RUN mode,
(RC_RUN mode,
INTOSC source)
, and all features that
F
INTRC source)
F
or V
OSC
OSC
SS
= 31 kHz
= 1 MHz
;