BF556C NXP Semiconductors, BF556C Datasheet - Page 2

BF556C

Manufacturer Part Number
BF556C
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BF556C

Channel Type
N
Configuration
Single
Gate-source Voltage (max)
-30V
Drain-gate Voltage (max)
-30V
Drain-source Volt (max)
30V
Operating Temperature (max)
150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Package Type
SOT-23
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BF556C
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
2. Pinning information
3. Ordering information
4. Marking
9397 750 13393
Product data sheet
Table 2:
Table 3:
Table 4:
[1]
Pin
1
2
3
Type number
BF556A
BF556B
BF556C
Type number
BF556A
BF556B
BF556C
* = p: made in Hong Kong.
* = t: made in Malaysia.
* = W: made in China.
Pinning
Ordering information
Marking
Description
source (s)
drain (d)
gate (g)
Package
Name
-
Rev. 03 — 5 August 2004
Description
plastic surface mounted package; 3 leads
BF556A; BF556B; BF556C
N-channel silicon junction field-effect transistors
Marking code
24*
25*
26*
Simplified outline
1
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[1]
3
SOT23
2
Symbol
g
sym054
Version
SOT23
d
s
2 of 13

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