MAX19711ETN+T Maxim Integrated Products, MAX19711ETN+T Datasheet - Page 2

• Manufacturer Part Number: MAX19711ETN+T
• Description: IC ANLG FRNT END 56-TQFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX19711ETN+T

• Number Of Bits: 10
• Number Of Channels: 2
• Power (watts): 37.5mW
• Voltage - Supply, Analog: 3V
• Voltage - Supply, Digital: 3V
• Package / Case: 56-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ELECTRICAL CHARACTERISTICS
(V
amplitude = -0.5dBFS, Tx DAC output amplitude = 0dBFS, V
DAC output, C
values are at T
ABSOLUTE MAXIMUM RATINGS
V DD to GND, OV DD to OGND ..............................-0.3V to +3.6V
GND to OGND.......................................................-0.3V to +0.3V
IAP, IAN, QAP, QAN, IDP, IDN, QDP,
ADC1, ADC2 to GND.................................-0.3V to (V DD + 0.3V)
REFP, REFN, REFIN, COM to GND ...........-0.3V to (V DD + 0.3V)
AD0–AD9, DA0–DA9, SCLK, DIN,
10-Bit, 11Msps, Full-Duplex
Analog Front-End
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
POWER REQUIREMENTS
Analog Supply Voltage
Output Supply Voltage
V
DD
QDN, DAC1, DAC2, DAC3 to GND .....................-0.3V to V DD
CLK, DOUT to OGND .........................-0.3V to (OV DD + 0.3V)
DD
_______________________________________________________________________________________
= 3V, OV
Supply Current
PARAMETER
A
REFP
DD
= +25°C.) (Note 1)
= 1.8V, internal reference (1.024V), C
= C
REFN
= C
COM
CS/WAKE,
= 0.33µF, C
SYMBOL
OV
V
DD
DD
L
< 5pF on all aux-DAC outputs, T
FD m od e: f
b oth D AC channel s; f
AD C channel s; aux- D AC s O N and at
m i d scal e, aux- AD C O N
FD mode: f
620kHz on both DAC channels; f
1.87MHz on both ADC channels; aux-
DACs ON and at midscale, aux-ADC ON
SPI2-Tx mode: f
620kHz on both DAC channels; Rx ADC
OFF; aux-DACs ON and at midscale, aux-
ADC ON
SPI1-Rx mode: f
1.87MHz on both ADC channels; Tx DAC
OFF (Tx DAC outputs at 0V); aux-DACs
ON and at midscale, aux-ADC ON
SPI4-Tx mode: f
620kHz on both DAC channels; Rx ADC
ON (output tri-stated); aux-DACs ON and
at midscale, aux-ADC ON
SPI3-Rx mode: f
1.87MHz on both channels; Tx DAC ON
(Tx DAC outputs at midscale); aux-DACs
ON and at midscale, aux-ADC ON
Standby mode: CLK = 0 or OV
aux-DACs ON and at midscale,
aux-ADC ON
L
≈ 10pF on all digital outputs, f
FS
C LK
CLK
= 410mV, CM1 = 0, CM0 = 0, differential Rx ADC input, differential Tx
CONDITIONS
= 11M H z, f
= 4.915MHz, f
CLK
CLK
CLK
CLK
Continuous Power Dissipation (T A = +70°C)
Thermal Resistance θ JA ..................................................36°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
= 11MHz, f
= 11MHz, f
56-Pin Thin QFN-EP (derate 27.8mW/°C above +70°C) 2.22W
= 11MHz, f
= 11MHz, f
I N
= 1.87M H z on b oth
OU T
OUT
= 620kH z on
DD
OUT
OUT
IN
IN
A
IN
;
= T
=
=
=
=
CLK
=
=
MIN
= 11MHz (50% duty cycle), Rx ADC input
to T
MAX
MIN
2.7
1.8
, unless otherwise noted. Typical
14.25
TYP
12.5
11.5
14.1
13.8
3.0
8.1
MAX
16.5
16.5
V
3.3
17
14
10
DD
4
UNITS
mA
V
V