MT47H32M16BN-25:D Micron Technology Inc, MT47H32M16BN-25:D Datasheet - Page 28

• Manufacturer Part Number: MT47H32M16BN-25:D
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16BN-25:D

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 295mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Table 6: Temperature Limits
Figure 14: Example Temperature Test Point Location
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Notes:
Test point
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 14 (page 28). This case temperature limit is allowed to be exceeded briefly
during package reflow, as noted in Micron technical note TN-00-15, “Recommended Sol-
dering Parameters.”
in Figure 14 (page 28).
operation.
Lmm x Wmm FGBA
Width (W)
0.5 (W)
Electrical Specifications – Absolute Ratings
Symbol
0.5 (L)
28
T
T
T
T
T
T
Length (L)
STG
C
C
A
C
A
STG
C
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package, as shown
is measured in the center of the package, as shown
Min
512Mb: x4, x8, x16 DDR2 SDRAM
–55
–40
–40
–40
–40
0
Max
150
105
105
85
95
85
© 2004 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
C
during
2, 3 , 4
Notes
2, 3, 4
2, 3
4, 5
4, 5
1