MT47H64M16HR-3 IT:HTR Micron Technology Inc, MT47H64M16HR-3 IT:HTR Datasheet - Page 20
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MT47H64M16HR-3 IT:HTR
Manufacturer Part Number
MT47H64M16HR-3 IT:HTR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Specifications of MT47H64M16HR-3 IT:HTR
Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
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Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. W 7/11 EN
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
60X Ø0.45
8 CTR
Seating
0.12 A
plane
0.8 TYP
0.8 TYP
Notes:
A
9
8
7
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
6.4 CTR
36%Pb, 2% Ag).
8 ±0.1
3
2
1
A
B
C
D
E
F
G
H
J
K
L
Exposed
gold-plated pad
1.0 MAX X 0.7
nonconductive
floating pad
0.8 ±0.1
Ball A1 ID
11.5 ±0.1
20
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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