MPC8313ECZQAFFB Freescale Semiconductor, MPC8313ECZQAFFB Datasheet - Page 21
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MPC8313ECZQAFFB
Manufacturer Part Number
MPC8313ECZQAFFB
Description
IC MPU POWERQUICC II PRO 516PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8313CZQAFFB.pdf
(100 pages)
Specifications of MPC8313ECZQAFFB
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
333MHz
Voltage
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8313E-RDB
Maximum Clock Frequency
333 MHz
Operating Supply Voltage
1 V, 3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1 V, 1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
- 40 C
For Use With
MPC8313E-RDB - BOARD PROCESSOR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8313ECZQAFFB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
7.2
Table 23
8
This section provides the AC and DC electrical characteristics for three-speed, 10/100/1000, and MII
management.
8.1
The electrical characteristics specified here apply to all the media independent interface (MII), reduced
gigabit media independent interface (RGMII), serial gigabit media independent interface (SGMII), and
reduced ten-bit interface (RTBI) signals except management data input/output (MDIO) and management
data clock (MDC). The RGMII and RTBI interfaces are defined for 2.5 V, while the MII interface can be
operated at 3.3 V. The RMII and SGMII interfaces can be operated at either 3.3 or 2.5 V. The RGMII and
RTBI interfaces follow the Hewlett-Packard reduced pin-count interface for Gigabit Ethernet Physical
Layer Device Specification Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC
are specified in
8.1.1
All RGMII, RMII, and RTBI drivers and receivers comply with the DC parametric attributes specified in
Table 24
defined by JEDEC EIA/JESD8-5.
Freescale Semiconductor
Minimum baud rate
Maximum baud rate
Oversample rate
Notes:
1. Actual attainable baud rate is limited by the latency of interrupt processing.
2. The middle of a start bit is detected as the 8
Supply voltage 3.3 V
Output high voltage
sampled each 16
Parameter
Ethernet: Three-Speed Ethernet, MII Management
provides the AC timing parameters for the DUART interface.
and
DUART AC Electrical Specifications
Enhanced Three-Speed Ethernet Controller (eTSEC)
(10/100/1000 Mbps)—MII/RMII/RGMII/SGMII/RTBI Electrical
Characteristics
TSEC DC Electrical Characteristics
Table
Section 8.5, “Ethernet Management Interface Electrical
th
sample.
MPC8313E PowerQUICC
25. The RGMII and RTBI signals are based on a 2.5-V CMOS interface voltage as
LV
Symbol
DDA
V
OH
/LV
DDB
Parameter
Table 23. DUART AC Timing Specifications
Table 24. MII DC Electrical Characteristics
I
OH
= –4.0 mA
th
sampled 0 after the 1-to-0 transition of the start bit. Subsequent bit values are
™
II Pro Processor Hardware Specifications, Rev. 3
Conditions
LV
—
DDA
or LV
DDB
= Min
Ethernet: Three-Speed Ethernet, MII Management
Characteristics.”
> 1,000,000
2.97
2.40
Min
Value
256
16
LV
LV
DDB
DDA
Max
3.63
or
baud
baud
Unit
+ 0.3
+ 0.3
—
Notes
Unit
—
1
2
V
V
21