MPC8313ECZQAFFB Freescale Semiconductor, MPC8313ECZQAFFB Datasheet - Page 76
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MPC8313ECZQAFFB
Manufacturer Part Number
MPC8313ECZQAFFB
Description
IC MPU POWERQUICC II PRO 516PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8313CZQAFFB.pdf
(100 pages)
Specifications of MPC8313ECZQAFFB
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
333MHz
Voltage
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8313E-RDB
Maximum Clock Frequency
333 MHz
Operating Supply Voltage
1 V, 3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1 V, 1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
- 40 C
For Use With
MPC8313E-RDB - BOARD PROCESSOR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8313ECZQAFFB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package and Pin Listings
76
V
XCOREV
XCOREV
XPADV
XPADV
Notes:
1. This pin is an open drain signal. A weak pull-up resistor (1 kΩ) should be placed on this pin to NV
2. This pin is an open drain signal. A weak pull-up resistor (2–10 kΩ) should be placed on this pin to NV
3. This output is actively driven during reset rather than being three-stated during reset.
4. These JTAG pins have weak internal pull-up P-FETs that are always enabled.
5. This pin should have a weak pull up if the chip is in PCI host mode. Follow PCI specifications recommendation.
6. This pin must always be tied to V
7. Internal thermally sensitive resistor, resistor value varies linearly with temperature. Useful for determining the junction
8. 1588 signals are available on these pins only in MPC8313 Rev 2.x or later.
9. LB_POR_CFG_BOOT_ECC_DIS is available only in MPC8313 Rev 2.x or later.
SS
temperature.
DD
SS
DD
SS
MPC8313E PowerQUICC
Signal
Table 63. MPC8313E TEPBGAII Pinout Listing (continued)
SS
.
™
II Pro Processor Hardware Specifications, Rev. 3
B1,B2,B8,B9,B16,B17,C1,
R16,R25,T6,T11,T12,T13,
C26,D3,D4,D12,D13,D20,
D21,F8,F11,F13,F16,F17,
T14,T15,T16,T21,T25,U5,
AD1,AE2,AE8,AE9,AE16,
L14,L15,L16,L21,L23,M4,
U6,U21,W4,W23,Y4,Y23,
F21,G2,G25,H2,H6,H21,
M11,M12,M13,M14,M15,
AC12,AC13,AC20,AC21,
H25,L4,L6,L11,L12,L13,
C2,C3,C4,C5,C24,C25,
R11,R12,R13,R14,R15,
N21,N23,P11,P12,P13,
AA8,AA11,AA13,AA16,
P14,P15,P16,P23,P25,
M16,M23,N6,N11,N12,
Package Pin Number
AA17,AA21,AC4,AC5,
N13,N14,N15,N16,
AE17,AF2
T1,U2,V2
P2,R2,T3
P5,U4
P3,V4
Core power for
Pad power for
transceivers
transceivers
Pin Type
SerDes
SerDes
(1.0 V)
(1.0 V)
—
—
—
DD
Freescale Semiconductor
.
DD
.
Supply
Power
—
—
—
—
—
Notes