MPC8313ECZQAFFB Freescale Semiconductor, MPC8313ECZQAFFB Datasheet - Page 94
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MPC8313ECZQAFFB
Manufacturer Part Number
MPC8313ECZQAFFB
Description
IC MPU POWERQUICC II PRO 516PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8313CZQAFFB.pdf
(100 pages)
Specifications of MPC8313ECZQAFFB
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
333MHz
Voltage
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8313E-RDB
Maximum Clock Frequency
333 MHz
Operating Supply Voltage
1 V, 3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1 V, 1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
- 40 C
For Use With
MPC8313E-RDB - BOARD PROCESSOR
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8313ECZQAFFB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Document Revision History
23 Document Revision History
Table 73
94
Number
Rev.
2.2
2.1
3
2
provides a revision history for this hardware specification.
01/2009
12/2008
10/2008
12/2008
Date
MPC8313E PowerQUICC
•
• Made cross-references active for sections, figures, and tables.
• Added Figure 2, after Table 2 and renumbered the following figures.
• Added Note “The information in this document is accurate for revision 1.0, and 2.x and later. See
• Added part numbering details for all the silicon revisions in Table 74.
• Changed V
• Added a row for V
• Added a column for maximum power dissipation in low power mode for Rev 2.x or later silicon in
• Added a column for Power Nos for Rev 2.x or later silicon and added a row for 400 MHz in Table 4.
• Removed footnote, “These are preliminary estimates.” from Table 4.
• Added Table 21 for DDR AC Specs on Rev 2.x or later silicon.
• Added Section 9, “High-Speed Serial Interfaces (HSSI).”
• Added LFWE, LFCLE, LFALE, LOE, LFRE, LFWP, LGTA, LUPWAIT, and LFRB in Table 63.
• In Table 39, added note 2: “This parameter is dependent on the csb_clk speed. (The MIIMCFG[Mgmt
• Removed mentions of SGMII (SGMII has separate specs) from Section 8.1, “Enhanced
• Corrected Section 8.1, “Enhanced Three-Speed Ethernet Controller (eTSEC)
• Added ZQ package to ordering information In Table 74 and Section 19.1, “Package Parameters for
• Removed footnotes 5 and 6 from Table 1 (left over when the PCI undershoot/overshoot voltages and
• Removed SD_PLL_TPD (T2) and SD_PLL_TPA_ANA (R4) from Table 63.
• Added Section 8.3, “SGMII Interface Electrical Characteristics.” Removed Section 8.5.3 SGMII DC
• Removed “HRESET negation to SRESET negation (output)” spec and changed “HRESET/SRESET
• Clarified POR configuration signal specs to “Time for the device to turn off POR configuration signal
• Added Section 24.2, “Part Marking,” and Figure 62.
Table
Section 24.1, “Part Numbers Fully Addressed by this Document,” before Section 1, “Overview.”
Table 6.
Clock Select] field determines the clock frequency of the Mgmt Clock EC_MDC.)”
Three-Speed Ethernet Controller (eTSEC) (10/100/1000 Mbps)—MII/RMII/RGMII/SGMII/RTBI
Electrical Characteristics.”
(10/100/1000 Mbps)—MII/RMII/RGMII/SGMII/RTBI Electrical Characteristics,” to state that
RGMII/RTBI interfaces only operate at 2.5 V, not 3.3 V.
the MPC8313E TEPBGAII” (applicable to both silicon rev. 1.0 and 2.1)
maximum AC waveforms were removed from Section 2.1.2, “Power Supply Voltage Specification”).
Electrical Characteristics.
assertion (output)” spec to “HRESET assertion (output)” in Table 10.
drivers with respect to the assertion of HRESET” and “Time for the device to turn on POR
configuration signal drivers with respect to the negation of HRESET” in Table 10.
74, in column aa, changed to AG = 400 MHz.
IH
from 2.7 V to 2.4 V in Table 7.
Table 73. Document Revision History
IH
level for Rev 2.x or later in Table 45.
™
II Pro Processor Hardware Specifications, Rev. 3
Substantive Change(s)
Freescale Semiconductor