MPC8315ECVRAGDA Freescale Semiconductor, MPC8315ECVRAGDA Datasheet - Page 80
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MPC8315ECVRAGDA
Manufacturer Part Number
MPC8315ECVRAGDA
Description
MPU POWERQUICC II PRO 620-PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8315VRADDA.pdf
(112 pages)
Specifications of MPC8315ECVRAGDA
Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
400MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
620-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8315ECVRAGDA
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MPC8315ECVRAGDA
Manufacturer:
FREESCAL
Quantity:
36
Company:
Part Number:
MPC8315ECVRAGDA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8315ECVRAGDA
Manufacturer:
FREESCALE
Quantity:
20 000
Package and Pin Listings
Figure 60
23 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8315E is available in
a thermally enhanced plastic ball grid array (TEPBGA II), see
MPC8315E TEPBGA II,”
on the TEPBGA II.
23.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,
TEPBGA II.
80
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
Package Parameters for the MPC8315E TEPBGA II
TDMxTFS (output)
shows the TDM transmit signal timing.
TDMxTFS (input)
TDMxRCK
TDMxTCK
TDMxTD
MPC8315E PowerQUICC
t
DMIVKH
and
Section 23.2, “Mechanical Dimensions of the TEPBGA II,”
Figure 60. TDM Transmit Signals
t
DM_OUTAC
t
DMTKHOV
™
II Pro Processor Hardware Specifications, Rev. 0
t
DM_HIGH
t
DMFSIXKH
29 mm × 29 mm
620
1 mm
2.23 mm
96.5 Sn/3.5 Ag (VR package)
0.6 mm
t
DMFSKHOV
t
DM
t
DM_LOW
Section 23.1, “Package Parameters for the
t
DM_OUTHI
t
DMTKHOX
Freescale Semiconductor
t
DMFSKHOX
for information