XPC8240RZU250E Freescale Semiconductor, XPC8240RZU250E Datasheet - Page 12

MCU HOST PROCESSOR 352-TBGA

XPC8240RZU250E

Manufacturer Part Number
XPC8240RZU250E
Description
MCU HOST PROCESSOR 352-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIr
Datasheets

Specifications of XPC8240RZU250E

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
200MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
352-TBGA
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
250MHz
Embedded Interface Type
I2C
Digital Ic Case Style
TBGA
No. Of Pins
352
Supply Voltage Range
2.5V To 2.75V
Rohs Compliant
No
Family Name
MPC82XX
Device Core Size
32b
Frequency (max)
250MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2.625/2.6255V
Operating Supply Voltage (max)
2.75625/2.756775V
Operating Supply Voltage (min)
2.49375/2.494225V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
352
Package Type
TBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

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Electrical and Thermal Characteristics
Electrical and Thermal Characteristics
clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core
frequency; see Section 1.9, “Ordering Information,” for information on ordering parts.
1.4.2.1
Table 6 provides the operating frequency information for the MPC8240.
1.4.2.2
Table 7 provides the clock AC timing specifications as defined in Section 1.4.2.3, “Input AC Timing
Specifications.”
12
At recommended operating conditions (see Table 2) with GV
At recommended operating conditions (see Table 2) with LV
Processor frequency (CPU)
Memory bus frequency
PCI input frequency
Note:
1. Caution: The PCI_SYNC_IN frequency and PLL_CFG[0:4] settings must be chosen such that the resulting
2.) The 250-MHz processor is only available as an R spec part. See Section 1.9.2, “Part Numbers Not Fully Addressed
Num
2, 3
1a
1b
5a
5b
8a
8b
10
15
4
7
peripheral logic/memory bus frequency and CPU (core) frequency do not exceed their respective maximum or
minimum operating frequencies. Refer to the PLL_CFG[0:4] signal description in Section 1.6, “PLL Configurations,”
for valid PLL_CFG[0:4] settings and PCI_SYNC_IN frequencies.
by This Document,” for more information.
Frequency of operation (PCI_SYNC_IN)
PCI_SYNC_IN cycle time
PCI_SYNC_IN rise and fall times
PCI_SYNC_IN duty cycle measured at 1.4 V
PCI_SYNC_IN pulse width high measured at 1.4 V
PCI_SYNC_IN pulse width low measured at 1.4 V
PCI_SYNC_IN jitter
PCI_CLK[0:4] skew (pin-to-pin)
SDRAM_CLK[0:3] skew (pin-to-pin)
Internal PLL relock time
DLL lock range with DLL_STANDARD = 1
Characteristic
AC Operating Frequency Data
Clock AC Specifications
Characteristic and Condition
MPC8240 Integrated Processor Hardware Specifications
1
Freescale Semiconductor, Inc.
For More Information On This Product,
Table 7. Clock AC Timing Specifications
Table 6. Operating Frequency
Go to: www.freescale.com
Min
100
1
DD
DD
= 3.3 V ± 0.3 V
200 MHz
= 3.3 V ± 5% and LV
Max
200
0
Min
33–100
25
40
40
(NT
25–66
6
6
DD
clk
= 3.3 V ± 5%
– t
Min
100
loop
– t
250 MHz
fix0
Max
150
500
350
100
2.0
66
15
60
9
9
)
7
2
Max
250
Unit
MHz
ns
ns
ns
ns
ps
ps
ps
µs
ns
%
MHz
MHz
MHz
Notes
3, 4, 6
Unit
2
3
3
8
7

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