XPC8240RZU250E Freescale Semiconductor, XPC8240RZU250E Datasheet - Page 40

• Manufacturer Part Number: XPC8240RZU250E
• Description: MCU HOST PROCESSOR 352-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC IIr

Specifications of XPC8240RZU250E

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 352-TBGA
• Core Size: 32 Bit
• Program Memory Size: 32KB
• Cpu Speed: 250MHz
• Embedded Interface Type: I2C
• Digital Ic Case Style: TBGA
• No. Of Pins: 352
• Supply Voltage Range: 2.5V To 2.75V
• Rohs Compliant: No
• Family Name: MPC82XX
• Device Core Size: 32b
• Frequency (max): 250MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.625/2.6255V
• Operating Supply Voltage (max): 2.75625/2.756775V
• Operating Supply Voltage (min): 2.49375/2.494225V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 352
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

System Design Information
System Design Information
voltage, the MPC8240 always performs 3.3-V signaling as described in the PCI Local Bus Specification,
(Rev 2.1). The MPC8240 only tolerates 5-V signals when interfaced into a 5-V PCI bus system.
1.7.8
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods: adhesive, spring clip to holes in the printed-circuit
board, or package and mounting clip and screw assembly. See Figure 26.
Figure 27 depicts the die junction-to-ambient thermal resistance for four typical cases:
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A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
of adjacent components.
A heat sink is not attached to the TBGA package, and there exists low board-level thermal loading
of adjacent components.
A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package, and there
exists high board-level thermal loading of adjacent components.
A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package, and there
exists low board-level thermal loading of adjacent components.
Figure 26. Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Management Information
Thermal Interface
MPC8240 Integrated Processor Hardware Specifications
Adhesive or
Freescale Semiconductor, Inc.
Material
Heat Sink
For More Information On This Product,
Die
Heat Sink
Clip
Go to: www.freescale.com
Printed-Circuit Board
TBGA Package
Option