MPC8255ACZUMHBB Freescale Semiconductor, MPC8255ACZUMHBB Datasheet - Page 14

• Manufacturer Part Number: MPC8255ACZUMHBB
• Description: IC MPU POWERQUICC II 480-TBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8255ACZUMHBB

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 266MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 480-TBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 266MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2V
• Operating Supply Voltage (max): 2.1V
• Operating Supply Voltage (min): 1.9V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 480
• Package Type: TBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Electrical and Thermal Characteristics
Figure 7 shows TDM input and output signals.
Figure 8 shows the interaction of several bus signals.
PSDVAL/TEA/TA output signals
AACK/ARTRY/TA/TS/TEA/
ADD/ADD_atr/BADDR/CI/
DBG/BG/BR input signals
DATA bus output signals
DATA bus normal mode
All other output signals
GBL/WT output signals
All other input signals
Activating data pipelining (setting BRx[DR] in the memory controller)
improves the AC timing. When data pipelining is activated, sp12 can be
used for data bus setup even when ECC or PARITY are used. Also, sp33a
can be used as the AC specification for DP signals.
input signal
TDM output signals
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
TDM input signals
CLKin
Serial CLKin
Freescale Semiconductor, Inc.
For More Information On This Product,
MPC8255 Hardware Specifications
Figure 7. TDM Signal Diagram
Go to: www.freescale.com
sp33a
sp35
sp31
sp32
Figure 8. Bus Signals
sp20
sp12
sp15
sp11
sp21
sp40/sp41
sp10
sp10
sp10
sp30
sp30
sp30
sp30