MPC8255ACZUMHBB Freescale Semiconductor, MPC8255ACZUMHBB Datasheet - Page 34

IC MPU POWERQUICC II 480-TBGA

MPC8255ACZUMHBB

Manufacturer Part Number
MPC8255ACZUMHBB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MPC8255ACZUMHBB

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
266MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
266MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2V
Operating Supply Voltage (max)
2.1V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
480
Package Type
TBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8255ACZUMHBB
Manufacturer:
MOTOROLA
Quantity:
745
Part Number:
MPC8255ACZUMHBB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8255ACZUMHBB
Manufacturer:
FREESCALE
Quantity:
20 000
Package Description
1.5.2
Figure 14 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package.
Mechanical Dimensions
Figure 14. Mechanical Dimensions and Bottom Surface Nomenclature
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Freescale Semiconductor, Inc.
For More Information On This Product,
MPC8255 Hardware Specifications
Go to: www.freescale.com
Notes:
1. Dimensions and Tolerancing per
2. Dimensions in millimeters.
3. Dimension b is measured at the
4. Primary data A and the seating
ASME Y14.5M-1994.
maximum solder ball diameter,
parallel to primary data A.
plane are defined by the spherical
crowns of the solder balls.
Dim
A1
A2
A3
D1
E1
D
A
E
b
e
1.45
0.60
0.85
0.25
0.65
Min
Millimeters
37.50 BSC
35.56 REF
37.50 BSC
35.56 REF
1.27 BSC
Max
1.65
0.70
0.95
0.85

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