MPC7410RX500LE Freescale Semiconductor, MPC7410RX500LE Datasheet - Page 29

• Manufacturer Part Number: MPC7410RX500LE
• Description: IC MPU 32BIT 500MHZ PPC 360-CBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC7410RX500LE

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 500MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

7 Package Description
The following sections provide the package parameters and mechanical dimensions for the MPC7410, 360 CBGA
and 360 HCTE packages.
7.1 Package Parameters for the MPC7410, 360 CBGA and
The package parameters are as provided in the following list. The package types are the 25 × 25 mm, 360-lead
ceramic ball grid array package (CBGA) or the 25 × 25 mm, 360-lead high coefficient of thermal expansion CBGA
package (HCTE_CBGA).
7.2 Package Parameters for the MPC7410, 360 HCTE_CBGA (Lead
The package parameters are as listed here. The package types are the 25 × 25 mm, 360-lead high coefficient of
thermal expansion CBGA package with lead-free C5 spheres (HCTE_CBGA lead-free spheres).
Freescale Semiconductor
360 HCTE_CBGA
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Coefficient of thermal expansion
Free C5 Spheres)
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Coefficient of thermal expansion
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
25 × 25 mm
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
2.72 mm
3.20 mm
0.89 mm (35 mil)
6.8 ppm/°C (CBGA)
12.3ppm/°C (HCTE_CBGA)
25 × 25 mm
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
2.32 mm
2.80 mm
0.76 mm (30 mil)
12.3ppm/°C
Package Description
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