PIC12F509-I/P Microchip Technology Inc., PIC12F509-I/P Datasheet - Page 71

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PIC12F509-I/P

Manufacturer Part Number
PIC12F509-I/P
Description
8 PIN, 1.5 KB FLASH, 41 RAM, 6 I/O
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC12F509-I/P

Cpu Speed
1 MIPS
Eeprom Memory
0 Bytes
Frequency
4 MHz
Input Output
6
Memory Type
Flash
Number Of Bits
8
Package Type
8-pin PDIP
Programmable Memory
1.5K Bytes
Ram Size
41 Bytes
Speed
4 MHz
Timers
1-8-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC12F509-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
10.1
© 2005 Microchip Technology Inc.
DC CHARACTERISTICS
D001
D002
D003
D004
D010
D020
D022
Legend: TBD = To Be Determined.
Note 1:
Param
No.
2:
3:
4:
5:
*
DC Characteristics: PIC12F508/509/16F505 (Industrial)
V
V
V
S
I
I
DD
PD
Sym
I
DD
DR
POR
VDD
WDT
a) The test conditions for all I
b) For standby current measurements, the conditions are the same, except that the device is in Sleep
These parameters are characterized but not tested.
Data in the Typical (“Typ”) column is based on characterization results at 25 C. This data is for design
guidance only and is not tested.
This is the limit to which V
The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on
the current consumption.
Does not include current through R
estimated by the formula:
I = V
The Power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
mode.
DD
Supply Voltage
RAM Data Retention Voltage
V
Power-on Reset
V
Power-on Reset
Supply Current
Power-down Current
WDT Current
DD
DD
/2R
Start Voltage to ensure
Rise Rate to ensure
EXT
DD
Characteristic
(mA) with R
; WDT enabled/disabled as specified.
(5)
(3)
DD
EXT
(5)
can be lowered in Sleep mode without losing RAM data.
DD
in k .
measurements in active operation mode are:
EXT
(2)
Preliminary
(in EXTRC mode only). The current through the resistor can be
Standard Operating Conditions (unless otherwise specified)
Operating Temperature -40 C
0.05
Min
2.0
*
Typ
PIC12F508/509/16F505
1.5*
V
170
0.4
1.7
0.1
1.0
15
SS
(1)
Max
TBD
TBD
TBD
TBD
TBD
TBD
5.5
Units
V/ms
mA
mA
V
V
V
A
A
A
A
See Figure 10-1
Device in Sleep mode
See Section 7.4 "DC Characteris-
tics" for details
See Section 7.4 "DC Characteris-
tics" for details
F
F
F
F
disabled
V
V
OSC
OSC
OSC
OSC
DD
DD
T
A
= 2.0V
= 2.0V
= 4 MHz, V
= 10 MHz, V
= 20 MHz, V
= 32 kHz, V
+85 C (industrial)
Conditions
SS
DD
, T0CKI = V
DD
DS41236B-page 69
DD
DD
= 2.0V
= 2.0V, WDT
= 3.0V
= 5.0V
DD
or V
(4)
DD
SS
,
.

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