HMP8117CNZ Intersil, HMP8117CNZ Datasheet - Page 42

IC VIDEO DECODER NTSC/PAL 80PQFP

HMP8117CNZ

Manufacturer Part Number
HMP8117CNZ
Description
IC VIDEO DECODER NTSC/PAL 80PQFP
Manufacturer
Intersil
Type
Video Decoderr
Datasheet

Specifications of HMP8117CNZ

Applications
Video
Voltage - Supply, Analog
4.75 V ~ 5.25 V
Voltage - Supply, Digital
4.75 V ~ 5.25 V
Mounting Type
Surface Mount
Package / Case
80-MQFP, 80-PQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HMP8117CNZ
Manufacturer:
Intersil
Quantity:
10 000
Absolute Maximum Ratings
Digital Supply Voltage (V
Analog Supply Voltage (VAA to GND) . . . . . . . . . . . . . . . . . . . 7.0V
Digital Input Voltages . . . . . . . . . . . . . . . GND - 0.5V to V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Temperature Range
HMP8117CN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
41. θ
POWER SUPPLY CHARACTERISTICS
Power Supply Voltage Range
Total Power Supply Current
Digital Power Supply Current
Analog Power Supply Current
Total Power Dissipation
DC CHARACTERISTICS: DIGITAL I/O (EXCEPT CLK2 and I
Input Logic High Voltage
Input Logic Low Voltage
Output Logic High Voltage
Output Logic Low Voltage
Input Leakage Current
Input/Output Capacitance
Three-State Output Current
Leakage
DC CHARACTERISTICS: CLK2 DIGITAL INPUT
Input Logic High Voltage
Input Logic Low Voltage
Input Leakage Current
Input Capacitance
DC CHARACTERISTICS: I
Input Logic High Voltage
Input Logic Low Voltage
Output Logic High Voltage
Output Logic Low Voltage
soldered to printed circuit board.
JA
is measured with the component mounted on an evaluation PC board in free air. Dissipation rating assumes device is mounted with all leads
PARAMETER
CC
to GND) . . . . . . . . . . . . . . . . . . . . 7.0V
2
C INTERFACE
42
V
CC
= V
C
V
SYMBOL
AA
IN
CC
I
P
I
IH
V
V
V
V
C
TOT
I
I
V
I
V
V
V
, C
V
V
= 5.0V, T
TOT
I
CC
AA
OZ
I
OH
IH
OH
OL
OL
, V
, I
IH
IH
IL
IN
IH
IL
IL
IL
OUT
IL
AA
A
CC
= +25°C
(Note 42)
CLK2 = 29.5MHz,
V
Outputs Not Loaded
V
V
I
I
V
Input = 0V or 5V
f = 1MHz (Note 42)
All Measurements Referenced to
Ground, T
V
V
V
Input = 0V or V
CLK2 = 1MHz (Note 42)
All Measurements Referenced to
Ground, T
V
V
I
I
OH
OL
OH
OL
+ 0.5V
CC
CC
CC
CC
CC
CC
CC
CC
CC
2
C INTERFACE)
= 4mA, V
= 3mA, V
= -4mA, V
= -1mA, V
= VAA = 5.25V
= Max
= Min
= Max,
= Max
= Min
= Max
= Max
= Min
HMP8117
A
A
TEST CONDITION
= +25°C
= +25°C
CC
CC
CC
CC
CC
= Min
= Min
Thermal Information
Thermal Resistance (Typical, See Note 41)
Maximum Power Dissipation
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Junction Temperatures . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C
= Max
= Max
MQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HMP8117CN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.78W
0.7xV
0.7xV
4.75
-450
MIN
-10
-10
-10
2.0
2.4
3.0
0
-
-
CC
CC
TYP
1.46
279
132
147
5
8
8
0.3xV
0.3xV
MAX
5.25
1.60
± 10
305
0.8
0.4
0.4
10
10
-
-
CC
CC
θ
April 19, 2007
JA
UNITS
FN4643.3
(°C/W)
46
mA
mA
mA
μA
pF
μA
μA
μA
pF
W
V
V
V
V
V
V
V
V
V
V
V

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