MC68HC811E2FN Freescale Semiconductor, MC68HC811E2FN Datasheet - Page 183

• Manufacturer Part Number: MC68HC811E2FN
• Manufacturer: Freescale Semiconductor

Specifications of MC68HC811E2FN

• Cpu Family: HC11
• Device Core Size: 8b
• Frequency (max): 4MHz
• Interface Type: SCI/SPI
• Program Memory Type: ROMLess
• Program Memory Size: Not Required
• Total Internal Ram Size: 256Byte
• # I/os (max): 38
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 3V
• On-chip Adc: 8-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 52
• Package Type: PLCC
• Lead Free Status / Rohs Status: Supplier Unconfirmed

11.6 52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
Freescale Semiconductor
C
J
G
0.51 (0.020)
-A-
R
S
F
M
T
A
S
B
N
M68HC11E Family Data Sheet, Rev. 5.1
D
K
S
H
52 PL
0.18 (0.007)
-B-
0.51 (0.020)
-T-
0.15 (0.006)
SEATING
PLANE
M
M
T
T
A
52-Pin Windowed Ceramic-Leaded Chip Carrier (Case 778B)
A
S
S
B
B
S
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION R AND N DO NOT INCLUDE
GLASS PROTRUSION. GLASS PROTRUSION
TO BE 0.25 (0.010) MAXIMUM.
ALL DIMENSIONS AND TOLERANCES
INCLUDE LEAD TRIM OFFSET AND LEAD
DIM
A
B
C
D
G
H
K
N
R
S
F
J
0.785
0.785
0.165
0.017
0.026
0.090
0.006
0.035
0.735
0.735
0.690
MIN
0.050 BSC
INCHES
0.795
0.795
0.200
0.021
0.032
0.130
0.010
0.045
0.756
0.756
0.730
MAX
19.94
19.94
18.67
18.67
17.53
MILLIMETERS
MIN
4.20
0.44
0.67
2.29
0.16
0.89
1.27 BSC
MAX
20.19
20.19
19.20
19.20
18.54
5.08
0.53
0.81
3.30
0.25
1.14
183