MC68HC811E2FN Freescale Semiconductor, MC68HC811E2FN Datasheet - Page 184

MC68HC811E2FN

Manufacturer Part Number
MC68HC811E2FN
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC68HC811E2FN

Cpu Family
HC11
Device Core Size
8b
Frequency (max)
4MHz
Interface Type
SCI/SPI
Program Memory Type
ROMLess
Program Memory Size
Not Required
Total Internal Ram Size
256Byte
# I/os (max)
38
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
3V
On-chip Adc
8-chx8-bit
Instruction Set Architecture
CISC
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
52
Package Type
PLCC
Lead Free Status / Rohs Status
Supplier Unconfirmed

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Part Number
Manufacturer
Quantity
Price
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Manufacturer:
MOT
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Part Number:
MC68HC811E2FN2
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Part Number:
MC68HC811E2FNE2
Manufacturer:
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Quantity:
1 238
Ordering Information and Mechanical Specifications
11.7 64-Pin Quad Flat Pack (Case 840C)
184
L
C
H
E
49
64
G
48
1
0.20 (0.008)
0.05 (0.002) A–B
0.20 (0.008)
–D–
DETAIL C
M
M
M
M
DETAIL C
A
S
L
H
C
DETAIL A
A–B
A–B
X
M68HC11E Family Data Sheet, Rev. 5.1
K
S
S
U
D
D
S
S
Q
T
33
16
R
32
17
SEATING PLANE
–C–
B
–H–
0.10 (0.004)
SEATING PLANE
DATUM PLANE
V
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS A–B AND –D– TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. DIMENSION K IS TO BE MEASURED FROM THE
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUM PLANE –H–.
SEATING PLANE –C–.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED 0.53
(0.021). DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OR THE FOOT.
THEORETICAL INTERSECTION OF LEAD FOOT
AND LEG CENTERLINES.
DIM
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
U
V
X
F
J
L
T
0.20 (0.008)
B
J
13.90
13.90
0.067
0.130
0.130
16.20
16.20
MILLIMETERS
MIN
2.07
0.30
2.00
0.30
0.50
0.13
1.10
12.00 REF
0.80 BSC
5
0.40 BSC
2
0.20 REF
0
Ç Ç Ç Ç
É É É É
Ç Ç Ç Ç
É É É É
Ç Ç Ç Ç
SECTION B–B
DETAIL A
14.10
14.10
0.250
0.230
0.170
16.60
16.60
MAX
Freescale Semiconductor
2.46
0.45
2.40
0.66
0.30
1.30
–––
10
–––
8
M
F
D
C
0.547
0.547
0.081
0.012
0.079
0.012
0.003
0.005
0.020
0.005
0.005
0.638
0.638
0.043
MIN
0.031 BSC
0.472 REF
0.016 BSC
0.008 REF
A–B
5
2
0
INCHES
–A–, –B–, –D–
P
MAX
0.555
0.555
0.097
0.018
0.094
0.010
0.090
0.026
0.007
0.012
0.654
0.654
0.051
S
–––
10
–––
8
BASE
METAL
N
D
S

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